Qnity

Designing ADAS electronics? Automotive electronic performance is only as strong as the interconnects that support it, especially under thermal and environmental stress. Explore a new interactive content hub highlighting our innovative solutions for the automotive industry. ✅ Materials + application expertise ✅ Built for reliability ✅ Designed for next-gen mobility Explore the hub: https://lnkd.in/g5ACNrCh

Qnity is proud to be recognized as a Best Supplier at ASE’s Supplier Day 2026—a meaningful achievement that highlights the power of strong collaboration and shared commitment to innovation. Being recognized by one of the world’s leading semiconductor assembly and test partners underscores the impact of our teams. It speaks to the collaboration, expertise, and customer-first mindset we bring to our partners across the semiconductor ecosystem. A big thank you to ASE Global for the recognition and congratulations to everyone at Qnity whose focus, collaboration, and execution made this possible. We look forward to continuing this journey together. Read more about this recognition in our article: https://lnkd.in/gzdQvsXn #Qnity #SupplierExcellence #ASE #Semiconductor #Partnership #Innovation #AdvancedPackaging

We’re gearing up for the Automotive Engineering Exposition 2026 (JSAE) in Yokohama, Japan! We’re excited to collaborate with the innovators and engineers powering the next leap in mobility. Join us as we drive automotive advancement together. How can you find us? Come to Booth 304 from May 27–29 to explore a comprehensive portfolio designed for automotive performance, reliability, and efficiency, including: ·      Pyralux® flex circuit laminates and adhesive systems ·      Kapton® polyimide films ·      Laird™ thermal interface materials, enclosure solutions and absorbers ·      Activegrid™ conductive inks and films ·      Silveron™ GT‑210 high‑durability silver solutions   What can you expect? A wide range of leading-edge technologies designed to tackle automotive challenges—from thermal management and EMI shielding to flexible electronics and next-generation interconnects. Our leading-edge technologies are designed to help engineers create vehicles that perform reliably, drive efficiently, and accelerate the future of mobility. In this brief video, KAZUYUKI NAKAI shares an exclusive look at the advanced solutions we’re bringing to JSAE—empowering the next wave of automotive innovation. #JSAE #AutomotiveEngineering #ADAS #Qnity

Our team has had an incredible time connecting with automotive innovators and thought leaders at CTI SYMPOSIUM - Automotive • Powertrain • Systems. From discussions on AI-enabled powertrain development and high-voltage electrification to advances in battery systems, thermal management and smart vehicle architecture, the conversations this week highlight how rapidly automotive requirements are evolving. Susan Herczeg, Himanshu Kolambe, Maria Rzeznik, and Franco Quagliata have been connecting with attendees and sharing how our advanced materials portfolio is helping engineers tackle the toughest challenges in next-generation automotive mobility. If you haven't stopped by yet, come find us at Booth A-3 — we'd love to talk. #CTISymposium #Automotive #PowerElectronics #ADAS #Qnity

Laird™ Tflex™ SF16 thermal gap filler delivers industry-leading 16 W/mK thermal conductivity with exceptionally low hardness. With a non-silicone based formulation, it addresses the need for efficient heat transfer in high-density AI data center and automotive designs while minimizing mechanical stress on sensitive components.  In applications where thermal management is critical, Tflex™ SF16 gap filler offers: ✔ Low thermal resistance ✔ Soft, compressible design to help protect sensitive components ✔ RoHS and REACH compliant Learn more: https://lnkd.in/gXK_7EDM

⚡We’re wrapping up our final day at SEMI’s Surface Preparation and Cleaning Conference (SPCC) in Chandler, AZ! ⚡ It’s been a great few days sharing our solutions for wet etch and cleans, while engaging with peers across the semiconductor ecosystem. We were also glad to contribute through our technical presentation, where Chun-Ren (Jack) Ke shared insights on new developments in silicon-germanium etchants for advanced semiconductor devices. If you’re onsite, don’t miss the chance to stop by and explore what’s next in advanced cleaning innovation together! #Qnity #PoweredbyQnity #Semiconductor #SemiconductorCleans #SEMI_SPCC 

Advanced packaging demands materials that keep pace with rapid innovation. From tall copper pillar plating to fine-pitch solder bumping and 3DIC encapsulation, Qnity's advanced packaging portfolio is designed to help engineers tackle the toughest integration challenges across HBM, TSV, and fan-out architectures. 📄 Review our advanced packaging brochure to explore featured products: https://lnkd.in/g-UDpMEr 📍And learn about our advanced packaging offerings at the 2026 Electronic Components and Technology Conference (ECTC) in Orlando, Florida. From May 26-29, our team will be at Booth #1100 sharing our latest innovations enabling higher data speeds, processing power, lower latency, and greater network capacity in AI and 5G applications. If you're attending the show, stop by our booth and say hello! #AdvancedPackaging #Semiconductor #Electronics #Qnity

We’re at a pivotal point for both the semiconductor industry and the broader technology sector. As AI and advanced computing accelerate, leadership will come not just from innovation, but from the ability to build the right connections across the ecosystem and execute with discipline. That made my fireside chat with Michael Cornwell, Field CTO, Americas Everpure, yesterday at the NYSE #TechSummit in San Francisco, especially timely. In our session, “Inside the infrastructure enabling the AI boom,” we talked about what it will take to support the next phase of AI growth—and why infrastructure readiness is becoming a real competitive differentiator. I appreciated the opportunity to be part of the conversation with such a sharp group of investors and industry leaders. My takeaway: the next chapter of leadership in semiconductors and AI will be defined by the companies that can pair innovation with the infrastructure and execution to scale it. 

🏆 Qnity has received the BorgWarner Innovation Award for our support of the brand’s electric vehicle motor drive programs. We’re excited to partner with BorgWarner, a global leader in automotive and e-mobility innovation. Together, we’re bringing Laird™ thermal management solutions to electric vehicle power modules—helping drive greater efficiency, reliability, and power density in today’s most advanced EVs. What truly set this collaboration apart was how our Qnity teams rallied to partner with BorgWarner. Our sales, field application engineering, product management, and manufacturing teams all played a role in developing a partnership built on reliability, technical expertise, and excellence in execution. Thank you to the BorgWarner team for this honor, and to everyone at Qnity who made it happen. Read more about the collaboration and award: https://lnkd.in/grHuWQkQ #ElectricVehicles #ThermalManagement #Innovation #AutomotiveTech #EVMobility 

Qnity Electronics is becoming one of the quieter winners of the AI chip boom. 🚀 The semiconductor materials company jumped 10% after beating Q1 expectations, with adjusted earnings of $1.08 per share on $1.32 billion in revenue. Goldman Sachs analyst James Schneider said he expects the stock to hold its gains after a strong quarter and higher 2026 guidance. With the stock nearly doubling this year, Wall Street is still treating Qnity as a key way to play AI chip packaging momentum. #AI #Semiconductors Jon Kemp Karin De Bondt Meg Miller