Janusz Rajski

Big news from Micron today—this marks a pivotal moment in our mission to advance U.S. semiconductor leadership. We’re expanding our U.S. investments to approximately $200 billion, reinforcing our long-term commitment to domestic memory manufacturing and R&D. This includes: - A second leading-edge memory fab in Boise, Idaho—complementing the high-volume fab already under construction - Expansion and modernization of our Manassas, Virginia facility - Plans to bring advanced HBM packaging capabilities to the U.S. - A $50 billion investment in domestic R&D - Continued progress toward our planned megafab in New York These initiatives are expected to create around 90,000 direct and indirect jobs and will help us meet the surging demand for AI-driven innovation. As someone closely involved in our U.S. expansion strategy, I’m incredibly proud of what this means for our communities, our workforce, and the future of American-made memory. This is about more than just scale—it’s about building resilience, driving innovation, and securing leadership in a critical industry. Thank you to our federal, state, and local partners for your support—and to the Micron team, whose dedication makes this possible. Read more about the announcement: https://lnkd.in/gqGUNQRX See the scale of our Idaho construction: https://lnkd.in/g_Cd4FXA

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Excited to share Synopsys Inc first-pass silicon success on TSMC's N2 for MIPI and USB IP. This is a key milestone for AI-enabled edge devices on GAA nanosheet technology. Our customers can speed their time to market with our IP solutions for TSMC's N2 and N2P designs. Looks at these excellent results below, and learn more on our recent blog: https://lnkd.in/gyj3zVAJ

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the Lip-Bu Tan became Intel Corporation’s CEO this year, known for leading a huge turnaround at Cadence. He is now applying his strategies to revive Intel’s fortunes. Lip-Bu Tan, Intel’s new CEO, is leading a major transformation focused on streamlining operations, enhancing core engineering, and positioning the company for growth in #AI, #quantum, and #robotics. At Cadence, Tan grew the stock from about $5.50 to $186—a 3,200% gain over 12 years. Intel’s shares currently trade near $20, showing room for growth. Tan has already cut jobs, reduced layers of management, and refocused Intel on its core engineering strengths. He plans to sell off non-core assets and improve customer focus, aiming to boost performance over time. Intel is also pushing forward in AI with new hardware and software projects led by Chief Technology and AI Officer Sachin Katti. Their quantum computing efforts and partnerships with major tech firms could strengthen Intel’s position. Intel is also betting big on its #18A process node. Find my simple video explainer for Intel18A in the comments section. Additionally, Intel may benefit from U.S. manufacturing policies and the growing humanoid robot market, which Goldman Sachs projects to reach $38 billion by 2035. Intel’s processors and cameras could become essential in these robots. For a deeper understanding of the latest semiconductor technologies, check out my new book, Semiconductor for All. It covers developments like these in detail and their real-world impact. Get your copy now on Amazon Kindle! https://lnkd.in/gzVV2fJm , For more updates and insights on AI and semiconductor, check out my blog, https://lnkd.in/gUmGrQh4 #semiconductor #ai #chips #manufacturing #semiconductorforall

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TSMC Describes #Technology Innovation Beyond A14 The inaugural event for the 2025 #TSMC Technology Symposium recently concluded in Santa Clara, #California. This will be followed by events around the world over the next two months. SemiWiki.com has summarized information from this event regarding process technology innovation and #advancedpackaging innovation. Overall, the A14 process node was deemed to define the most advanced technology available from TSMC. Recently, a presentation (by Dr. Yuh-Jier Mii, EVP and Co-Chief Operating Officer at TSMC) from the event was posted that discusses technology leadership, and in that presentation, what lies beyond A14. Seeing what’s around the next corner is always interesting. Let’s look at how TSMC describes technology innovation beyond A14. A very big thank you again to Mike Gianfagna and SemiWiki.com for the full article with more background, Charts and insights via the link below 💡🙏👇 https://lnkd.in/e4qabtdc #semiconductorindustry #semiconductormanufacturing #tech #chip #ic #ai #chip #geopolitics #asml #foundry #taiwan #usa #innovation #ic #it

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Today Cadence announced acquisition of ARM Artisan Foundation IP Business to expand the IP offerings for customers worldwide. “During its 25-year history, Arm’s Artisan IP has established a strong presence and reputation in the global ecosystem of foundries and SoC partners. With the expected addition of the Artisan IP business and team, Cadence will enter the foundation IP market, enabling us to capitalize on new growth opportunities,” said Boyd Phelps #CadenceSSG #CadenceSRG Anirudh Devgan Boyd Phelps Dasaradha Gude

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AI isn’t slowing down, and Broadcom continues expanding its optical interconnect solutions portfolio for next-gen AI infrastructure. Today, we’re proud to announce the expansion of our industry-leading 200G/lane DSP PHY portfolio with the introduction of Sian3 and Sian2M, purpose-built for the demanding connectivity requirements of AI/ML clusters. Learn more: https://dy.si/HM9MHj2

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Ever wonder what solar panels could do if they had brains? That’s basically what HTEC and Infineon Technologies pulled off. Their AI-powered system, running on Infineon’s PSOC™ Edge platform, uses real-time voltage, current, and temperature data to tweak power output on the fly—no fancy irradiance sensors needed. ⚡ 23× faster response 🔋 42× less energy used 🔧 Built-in predictive maintenance Smarter energy. Less waste. More uptime. This is the kind of tech that moves us forward. Curious how it works? 🔗 Check out the whitepaper: https://lnkd.in/gKqhM_F4

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High-speed ADC/DAC systems are at the core of applications such as software-defined radio, test & measurement, medical imaging, and industrial sensing, where deterministic latency and timing consistency are non-negotiable. This JESD204B implementation on Efinix, Inc. Titanium FPGA, demonstrated with Texas Instruments data converters and developed by Logic Fruit Technologies, is a solid example of moving from theory to measured, validated performance, including stable bring-up, synchronization, and deterministic latency. If you’re working on JESD204B-based ADC/DAC designs, check out more resources on the Efinix website. https://lnkd.in/gFnbW8uS #Efinix #FPGA #JESD204B #TI #AFE58 #DAC38

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Code meets silicon: A hybrid approach to chip design Semi-custom design balances abstraction with detail. Combining digital logic with physics-based transistor tweaks delivers the best of both worlds. The result? Smarter chips that run faster and cooler.

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The most underrated debug technique in RTL? Writing assertions for your own assumptions. They have saved me from so many subtle logic bugs that would have taken hours to trace. If something must be true for your design to work, assert it.

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Recently two our customers brought up their chips with GUC’s HBM3E PHY and Controller IPs. The projects were done in TSMC’s 3nm process node and achieved target speed with good margins both in production test and customers’ systems. New designs use our HBM4/4E PHY and Controller IPs which were taped out in March/2025 and will be validated with first memory vendors’ HBM4 samples in Q2/2026. HBM4E gains 3.3x bandwidth, 2.6x area efficiency and 1.4x power efficiency vs. HBM3E (see a table). Like in all @GUC’s UCIe and HBM PHYs, proteanTecs in-mission mode signal quality monitoring is intergrated.

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