It was a privilege to deliver a keynote at the Chiplet Summit this week on a vital topic: "Redefine 3D IC Performance for AI — With AI." During my address, we explored some really groundbreaking areas: ▪️ Beyond Moore’s Law: How are we going to meet the incredible 1000x scaling demand that AI applications are pushing for? It's a challenge, but one we're ready to tackle! ▪️ AI's Accelerating Role: We discussed how AI isn't just a consumer of advanced chips; it's also a powerful catalyst, accelerating the inflection point for 3D ICs and reshaping how we design them. ▪️ Boosting Productivity with AI: And of course, how can AI itself boost 3D IC design productivity? We uncovered exciting ways to leverage AI to streamline workflows and unlock new levels of innovation. Redefining 3D IC performance for AI, with AI, is not just a vision—it's a reality. By embracing a system-driven approach, leveraging advanced multi-physics modeling, ensuring scalability, and implementing robust multi-die signoff, we can help you navigate this complex landscape and achieve unparalleled performance. Also - Congratulations to the coordinators of the Chiplet Summit this week - it was an excellent event to be a part of! #3DIC #AI #EDA #ChipletSummit #Semiconductors #IndustrialAI #Siemens
