Jake Johnson, MBA

Are YOU prepared to participate in the golden decade of the printed circuit industry? Taiwan's PCB output for the first half of 2025 surged nearly 14% to more than $13 billion. At the TPCA's “Semiconductor X PCB Heterogeneous Integration Summit Forum” Chairman Charles Shen of the Zhen Ding Technology Group said, "... that from personal computers and mobile devices to cloud data centers, AI, and AIoT, the evolution of all electronic products is deeply tied to the development of PCBs and semiconductors. As AI and advanced packaging technologies continue to advance, PCBs are no longer silent supporters but are now being recognized as key forces driving industrial transformation." He stated that the role of PCBs is shifting from “signal connection” to “system support.”  A post event column by Flora Wang, Taipei; Charlene Chen, DIGITIMES Asia stated, "The global AI wave is driving a “golden decade” for the printed circuit board (PCB) industry, sparking revolutionary innovations in design, manufacturing, and materials that accelerate its integration with advanced semiconductor sectors. This trend has not only exposed upstream capacity pressures but also intensified geopolitical risks, profoundly reshaping global PCB investment strategies." All of the aforementioned and more was reported in the Custer Consulting Group's Daily News of October 27.

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At SEMICON Taiwan, TSMC provided details on “COUPE,” integrating electronic and photonic circuits through advanced bonding. The company highlighted silicon photonics’ advantage in scaling with WDM on a single fiber vs electrical that requires many wirings.

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IEEE EPS official website:2026 International Through Glass via Technology Innovation and Application Forum (ITGV) Focusing on glass substrates, FOPLP, GCP, TGV, CPO, and CoPoS、Glass PCB https://lnkd.in/gS34Efqw

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💰 2025 Memory Industry Profit Snapshot Full-Year vs Quarterly – Who Earned How Much? After two years of downturn, 2025 marked a powerful structural rebound driven by AI infrastructure and HBM demand. Here’s a time-labeled breakdown: 🔵 Samsung Electronics FY2025 (Full Year) Revenue: $233.8B (+10.9%) Operating Profit: $30.5B (+33%) Net Profit: $31% YoY growth DS (Semiconductor) Division – FY2025 Operating Profit: ₩24.9T (+64.9%) Q4 2025 – Memory Business Revenue: ₩37.1T (+61.3% YoY, +39% QoQ) → Record quarterly revenue & profit 🔴 SK hynix FY2025 (Full Year) Revenue: $68.16B (+47%) Net Profit: $30.13B Net Margin: 44% Q4 2025 Revenue: ₩32.83T (+66% YoY, +34% QoQ) → Best quarter in company history 🟢 Micron FY2025 (Ended Aug 28, 2025) Revenue: $37.38B (vs $25.11B previous year) FY2026 Q1 (Ended Nov 27, 2025) Revenue: $13.64B (+56.6% YoY) HBM capacity sold out through end of 2026 🟣 Kioxia FY2025 Q3 (Jul–Sep 2025) Revenue: ¥448.3B (–7% YoY, +31% QoQ) Operating Profit: ¥85.9B Net Profit: ¥40.7B 🟡 Western Digital FY2026 Q2 (Ended Jan 2, 2026) Revenue: $3.02B (+25% YoY) Gross Margin: 46.1% Q3 guidance: ~48% Long-term contracts signed through 2027–2028 🟠 SanDisk FY2026 Q2 Revenue: $3.03B Gross Margin: 51.1% Q3 guidance: 65–67% Data center revenue: +64% QoQ 🟤 Winbond FY2025 (Full Year) Revenue: NT$89.4B (+9.6%) Jan 2026 Revenue: NT$11.78B (First time above NT$10B) 🟢 GigaDevice FY2025 (Estimated) Revenue: RMB 9.2B (+25%) Net Profit: +46% YoY 📈 What Changed in 2025? • AI servers drove HBM and DDR demand • Data center SSD content per rack increased • Memory pricing reversed upward • Supply discipline improved 2025 wasn’t just a recovery year. It marked the start of a new AI-driven memory cycle. #Memory #HBM #DDR5 #NAND #Semiconductor #AIInfrastructure #SupplyChain

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I’m excited to share that today Solidigm has well surpassed our $100M investment in our campus and R&D hub here in Greater Sacramento. This milestone is especially meaningful to me and the Corporate Services team at Solidigm—it reflects a long-term commitment to creating high‑quality workplaces and campus infrastructure that support collaboration, innovation, and our people, while helping drive global AI advancements. Grateful to our local partners and leaders who help make this possible. #AI #Corporateservices #Workplace #corporaterealestate

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BWS IoT's revolutionary and disruptive solution for tracker mobile NB-IoT for 4G, 5G and 6G (+likeli). What’s origineted in the USA in 2004 with Narrow Band (NB) only static tracking, has now changed forever in 2025. BWS IoT and pure NB-IoT mobile tracking: Our record between device NB-IoT and antena ERB Telecom: 66,13 Km ULTRA LONG-RANGE Tracker) New IoT tracking technology LPWA with NB-IoT is a pioneering and unique solution worldwide, patented by BWS IoT: - IoT technology with a longevity of at least +20 years (for 4G, 5G and 6G networks), - 10x greater antenna range ( record 66,13 Km from ERB). - Up to 50% lower monthly connectivity costs, - Only 2MB of monthly data consumption (not 20MB - Cat 1) via the BWS IoT Protocol. - 15 to 100 times ULTRA LOWER POWER consumption (tracker, Bait/autonomous) - ⁠Mobile Tracking NB-IoT: consumo de 0,3 mAh; - ⁠Bait/Isca carga: <10 µAh - Up to 20% lower final product cost. (comparison above pure NB2 IoT with 4G Cat 1 bis technology with 2G fallback) Innovation is in BWS IoT’s DNA https://lnkd.in/dQJczVhX

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🚀 Cadence has collaborated up with Arm in the "Arm Total Design" program to transform Arm-based SoC designs for AI/ML, 5G, and advanced workloads. Together, we’re streamlining the design process with Cadence’s full-flow solutions—helping you cut development costs, minimize risks, and launch your innovations faster. 💡 Want to learn more? Check out our solution brief here to see how we're driving first-pass silicon success! https://ow.ly/AsHy50Wz3nx #Semiconductors #AI #ML #5G #HighPerformanceComputing

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Move over, HBM—there may be an even more powerful memory architecture on the horizon. At the Future of Memory and Storage (FMS) Conference in Santa Clara, NEO Semiconductor unveiled its new “Extreme” High Bandwidth Memory (X-HBM), which promises up to 16X more bandwidth or 10X higher density than "traditional" HBM. CEO Andy Hsu introduced the concept during his keynote yesterday, positioning X-HBM as a potential game-changer for future AI servers. More details via StorageNewsletter: https://lnkd.in/gi_S8eqd Will X-HBM become the next big leap in AI memory? Time will tell… but I’m looking forward to learning more. #Memory #AIChips #XHBM #FutureOfCompute #Semiconductors #ArtificialIntelligence

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Data center power management has become increasingly critical as hyperscalers ramp the availability of their AI technologies. Our acquisition of Hanley Energy Group will make Jabil a key partner for the world’s AI leaders, helping us deliver, deploy, and service custom data center solutions down to the rack level. Learn more: https://lnkd.in/gAsKF9Yi

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SIYATA MOBILE AND RAM® MOUNTS PARTNER TO LAUNCH INNOVATIVE IN-VEHICLE SOLUTIONS FOR PUSH-TO-TALK HANDSETS   Siyata Mobile Inc (#Nasdaq: #SYTA, #SYTAW), a global developer and vendor of mission-critical Push-to-Talk over Cellular (PoC) handsets and accessories, announced a strategic partnership with RAM® Mounts, an industry leader in rugged, U.S.-made mounting systems, to deliver advanced in-vehicle solutions tailored to Siyata's SD7, SD7 ULTRA handsets and future roadmap handsets.   The collaboration brings together Siyata's innovative suite of PoC handsets with RAM®'s trusted, high-performance mounting systems to create mission-ready communications solutions designed specifically for the demanding needs of first responders, transportation fleets, utility workers and enterprise customers.   https://lnkd.in/dEpwGTeD

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Back by popular demand, AiRA Activate is where the brightest minds in AI, telecom, and innovation collide. This year, we’re going bigger, spotlighting how #GenAI is reshaping the Telco & BEYOND + how it's unlocking productivity at scale. https://lnkd.in/ga5QTGBP What to expect: 1. Front-row access to industry pioneers pushing the boundaries of AI, autonomy, and connected networks. 2. Candid conversations on turning AI breakthroughs into real-world performance. 3. Networking with trailblazers redefining how telecom operators think about speed, efficiency, and intelligence. Featured voices include: Subutai Ahmad, CTO at Numenta — architect of neuromorphic AI and the Thousand Brains Project. Mike Farmwald, Numenta Board Member & Rambus Founder — serial entrepreneur behind six breakthrough chip companies. Bran Ferren, Co-Founder, Applied Minds — creative legend, former Walt Disney Imagineering Head, and visionary across art, design & AI. Dr. Anastassia Lauterbach, CEO, AI Edutainment & Fortune 500 executive mentor. Dr Shreekant (Ticky) Thakkar, Chief Researcher at TII, ex-Intel/HP Fellow with 87 patents. Don’t miss this chance to see how GenAI is moving from hype to hands-on transformation in telecom & BEYOND! Aira Technologies

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6G is no longer theoretical and the #engineering decisions being made today will define what comes next. Jessy Cavazos, Keysight’s #6G Solutions Lead, speaks with Kalyan Sundhar, Vice President and General Manager of Wireless Technologies at Keysight, on the practical realities behind #FR3 spectrum, non-terrestrial networks, sensing monetization, and AI-driven connectivity. Read the blog to understand how these technologies are shaping scalable, real-world 6G networks: https://gag.gl/Q6jKVU

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Telcos can now run AI inference, graphics, and simulation on a single platform. Amdocs is integrating NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs into the amAIz platform to enable efficient inferencing for mid-size models, accelerated simulation for agentic AI and autonomous networks, and lifelike avatars and digital twins. Read the blog to learn more.

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Graduate level Analog Circuit Design is one of the more complex core Electrical Engineering topics. It is exciting to see the progress in this field coming so quickly on the heels of initial efforts to use AI by great circuit's teachers like Behzad Razavi (https://lnkd.in/gPNrvbnB) samvid.ai and Prasad Gudem are democratizing the teaching of this complex subjects. Their latest demonstration has ~2X better outcomes than Razavi's initial study and offers a path to creating tightly constrained, finely optimized teaching systems that in certain cases can outperform not only the teaching assistant but also the professors. The talk was really fun. Everyone involved in teaching about circuit design should sit up and take notice of the extra-ordinary progress that can come from great teachers collaborating closely with AI experts. AI is not magic, its engineering. Teaching using AI is not heresy, it is about using the best engineering tools to produce the best student outcomes. Let the great AI revolution in graduate education begin!

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Dell'Oro Group just wrapped up the 3Q25 RAN report. I think the main message this quarter was continued stabilization, especially when we exclude China. With this metric, RAN revenue (baseband+radio HW/SW, excluding services) has now recorded four consecutive quarters of growing or stable revenue on a year-over-year basis. The nearly stable results for the 1Q25-3Q25 period bolster the flat growth thesis we have communicated for some time, reflecting the current state of 5G. While the outlook remains muted, it is worth noting that some of the key players are cautiously optimistic that more investments are needed over the long-term to ensure the networks evolve from a connectivity pipe into an intelligence grid. Additional highlights from the 3Q 2025 RAN report: In the quarter, growth in EMEA was nearly enough to offset declining revenue in North America and the Asia Pacific regions. The top 5 RAN suppliers, based on worldwide revenues for the 1Q25-3Q25 period, are Huawei, Ericsson, Nokia, ZTE Corporation, and Samsung Networks. Market is becoming more concentrated—the top five suppliers accounted for 96 percent of the 1Q25-3Q25 RAN market, up from 95 percent in 2024. Huawei and Ericsson’s worldwide RAN revenue share improved for the 1Q25-3Q25 period relative to 2024. Huawei and Nokia’s RAN revenue share outside of North America improved for the 1Q25-3Q25 period relative to 2024. The short-term outlook remains mostly unchanged, with total RAN expected to remain mostly stable in 2026. For more details, please see https://lnkd.in/gdBhqQhF

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Lynk and Smart Communications, Inc. are teaming up to bring Direct-to-Device (D2D) satellite connectivity to the Philippines, a milestone that brings us closer to a future where no one is left unconnected, no matter how remote the location. With over 7,000 islands, the Philippines is the perfect place to showcase how innovation and collaboration can overcome geographic challenges. Together, we’re redefining what it means to be truly connected — from the heart of the cities to the farthest shores. 🇵🇭🛰️ Proud to be part of this journey making space-based mobile communication a reality for everyone. #D2D #Satellite #LEO #Space James Alderdice https://lnkd.in/gV27YFY6

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The NTN chipset landscape just shifted. GCT’s new Cat-1 + NTN solution is more than another satellite-capable modem — it represents a structural evolution in how terrestrial and non-terrestrial connectivity can converge at scale. Until now, most 3GPP NTN silicon has focused on NB-IoT or Cat-M dual-mode support. That made sense for low-power IoT scenarios. But Cat-1 brings something fundamentally different to the table: broader global LTE footprint, higher throughput, and immediate compatibility with mainstream cellular deployments. Why does this matter? Because Cat-1 + NTN is not just about backup connectivity. It enables: • Seamless terrestrial-to-satellite fallback • Higher data-rate industrial devices • Asset tracking with richer telemetry • Tracker-class terminals ready for global deployment • Faster commercialization for OEMs From a market perspective, this architecture significantly expands NTN’s practical addressable market. At Fuzhou IoT Technology Ltd. (FZIoT), we see this as an important inflection point. Integrating Cat-1 with NTN aligns with what global device makers actually need: scalable, deployable, multi-mode solutions that work today — not just in theory. As a leading NTN service integrator, FZIoT continues to help bring advanced chipsets into real-world ecosystems, enabling turnkey device development across satellite networks. The question now is not whether NTN will scale — but which silicon architecture will define the next wave. Cat-1 + NTN may well be one of the answers. One Sky, One Connection.

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