ULVAC’s Brian Coppa to Present Industry Roadmap on Smart Manufacturing and Sustainability at SEMICON West
Brian Coppa, Ph.D., Product Engineering Lead at ULVAC and Chair of the SEMI “Accelerating Sustainability with Smart Manufacturing” Task Force (TF), will join industry leaders at SEMICON West to present a roadmap on how Industry 4.0 technologies are advancing sustainability in semiconductor device-making fabs.
The session, scheduled for October 8 at 2:00 p.m. in the Smart Manufacturing Pavilion, will feature Dr. Coppa alongside Amit Srivastava, Data Science Lead at Micron Technology and TF Co-chair. Together, they will outline the task force’s vision for how smart manufacturing practices can drive measurable progress toward sustainability goals in the semiconductor sector.
As the industry faces increasing pressure to reduce its environmental footprint while maintaining rapid technological advancement, the roadmap is expected to highlight strategies such as real-time data utilization, predictive analytics, and advanced process controls. These methods, enabled by Industry 4.0, are designed to cut energy use, reduce waste, and improve overall efficiency in high-volume manufacturing environments.
“Smart manufacturing is not just about operational efficiency, it’s a key enabler of a more sustainable semiconductor industry,” said Dr. Coppa. “This roadmap provides a path forward for fabs to achieve both performance and sustainability objectives.”
The presentation is part of SEMICON West’s broader focus on sustainability, a theme that has gained prominence as global supply chains and technology companies prioritize carbon reduction and resource efficiency.
Further details on the session can be found at the SEMICON West event program. https://lnkd.in/eX3mJBFi
