GSME

We're #Hiring: SoC Physical Implementation (PI, PD, PV) Engineers, Staff / Sr. Staff Location: Ho Chi Minh City, Vietnam GSME is seeking Staff and Sr. Staff engineers to take ownership of physical implementation for hierarchical block, block top, or chip top. You will work closely with customers, RTL designers, and the DFT, STA, and PnR teams to improve power, placement, timing, and PPA. For PI engineers: synthesis (logical + physical), PPA analysis, quality checks (LDRC, VCLP, GCA, LEC), MCMM STA, timing ECO, and timing sign-off. For PD engineers: package and bump map definition, IO ring and ESD network, floorplan, clock distribution, PG-mesh, block or top level PnR, physical verification (DRC, LVS), and reliability checks (EM, IR-drop). This position is ideal for an engineer with strong hands-on experience in ASIC/SoC implementation from RTL to GDS. Staff level requires 6+ years of experience and Sr. Staff requires 9+ years. Scripting skills in TCL, Python, or Perl are a plus. Apply Here: https://lnkd.in/gjddq3yp Why join GSME? GSME is a TSMC Open Innovation Platform (OIP) Value Chain Alliance (VCA) member, providing end-to-end ASIC services spanning IP development, front-end architecture, physical design, wafer manufacturing, advanced packaging, assembly, and testing. By joining the GSME Implementation team, you will work on a diverse portfolio of advanced SoC designs spanning IoT, Automotive, AI, HPC, and next-generation computing. You will have opportunities to own and lead full chip physical implementation and tape-out, from a small test chip to a big die for mass production, while collaborating with design teams worldwide. #SemiconductorJobs #PhysicalDesign #PhysicalImplementation #ASIC #SoC #VLSI #ChipDesign #Hiring #HiringNow #EngineeringJobs #Semiconductors #TechCareers #STA #PnR #HoChiMinhCity #Vietnam #Engineering #Careers #Apply Farhat Jahangir Ravikanth Lakamsani Hoang Nguyen Didier Margairaz Zarin Said Yolanda Ventura Vega TSMC Global Semiconductor Alliance Muse Semiconductor GSME Rashid Iqbal TSMC

GSME is not just a company; it is my vision to redefine the semiconductor service industry. This vision sets the industry on a new course, one where the customer becomes the prime owner of the entire process, empowered by fully transparent workflows that replace opacity with trust and accountability. By embedding transparency at every stage, from design to manufacturing, GSME transforms the traditional vendor‑driven model into a customer‑centric ecosystem. This approach ensures clarity, speed, and confidence, while positioning GSME as the catalyst for a new era of semiconductor services built on openness, collaboration, and long‑term value. TSMC Global Semiconductor Alliance Semiconductor Industry Association

We are proud to announce a strategic partnership between GSME and Teradyne to establish a state-of-the-art semiconductor test and evaluation center in Silicon Valley. This collaboration combines GSME’s turnkey design, manufacturing enablement, and engineering expertise with Teradyne’s industry-leading automated test platforms to help customers accelerate development, evaluation, and production readiness for next-generation devices. The new facility will support innovations across: - Hyperscaler AI - Automotive Semiconductors - Silicon Photonics - Power Management - RF Technologies - Emerging Semiconductor Applications Together, we are creating a high-performance environment that enables customers to reduce time-to-market and scale with confidence. We look forward to expanding engineering support globally and delivering world-class semiconductor test solutions for our customers. Read the full press release here: https://lnkd.in/gSkHXQRF TSMC Global Semiconductor Alliance Semiconductor Industry Association Farhat Jahangir Ravikanth Lakamsani Hoang Nguyen Didier Margairaz Zarin Said Yolanda Ventura Vega Rashid Iqbal Muse Semiconductor #GSME #Teradyne #Partnership #Semiconductor #AI #Hyperscaler #SiliconPhotonics #Automotive #RF #SiliconValley

We are proud to announce a strategic partnership between GSME and Teradyne to establish a state-of-the-art semiconductor test and evaluation center in Silicon Valley. This collaboration combines GSME’s turnkey design, manufacturing enablement, and engineering expertise with Teradyne’s industry-leading automated test platforms to help customers accelerate development, evaluation, and production readiness for next-generation devices. The new facility will support innovations across: - Hyperscaler AI - Automotive Semiconductors - Silicon Photonics - Power Management - RF Technologies - Emerging Semiconductor Applications Together, we are creating a high-performance environment that enables customers to reduce time-to-market and scale with confidence. We look forward to expanding engineering support globally and delivering world-class semiconductor test solutions for our customers. Read the full press release here: https://lnkd.in/gSkHXQRF TSMC Global Semiconductor Alliance Semiconductor Industry Association Farhat Jahangir Ravikanth Lakamsani Hoang Nguyen Didier Margairaz Zarin Said Yolanda Ventura Vega Rashid Iqbal Muse Semiconductor #GSME #Teradyne #Partnership #Semiconductor #AI #Hyperscaler #SiliconPhotonics #Automotive #RF #SiliconValley

GSME Microelectronics U.S. has officially joined TSMC’s Open Innovation Platform (OIP) Value Chain Alliance (VCA) as a member partner in North America. The collaboration expands GSME’s ability to provide end-to-end ASIC services spanning IP development, front-end architecture, physical design, wafer manufacturing, advanced packaging, assembly and testing.   The partnership comes as demand for advanced silicon continues to rise across AI, high-performance computing and next-generation computing. GSME is also developing 2.5D and 3D advanced packaging capabilities, including support for TSMC CoWoS-based architectures, while its agentic LLM platform provides supply-chain visibility across wafer production, assembly and yield.   Farhat Jahangir, President and CEO, GSME, said, “Joining TSMC's OIP ecosystem as a VCA partner in North America underscores our commitment to delivering a unified, execution-driven platform for our customers.” He said the company aims to provide a lower-risk path from early MPW exploration through high-volume production with end-to-end visibility. Percy Chang, Director of Emerging Business Development, TSMC, said, “TSMC is pleased to welcome GSME as an OIP Value Chain Alliance partner in North America.” He said combining TSMC’s advanced process and packaging technologies with GSME’s design and turnkey services will expand support for customers developing innovative silicon solutions.   #GSME #TSMC #Semiconductors #ChipDesign #ASIC #AdvancedPackaging #AI #HPC #SiliconInnovation #SemiconductorIndustry

Yesterday was an incredible day at the TSMC 2026 North America OIP Ecosystem Forum! We had great conversations with fellow OIP ecosystem members and shared that GSME is TSMC's newest VCA partner. It was a real highlight to celebrate the deep collaboration across the OIP ecosystem that is accelerating AI development. Thank you to everyone who stopped by and connected with us. Let's keep working together to push the boundaries of AI through the OIP leadership ecosystem! TSMC Global Semiconductor Alliance Semiconductor Industry Association Farhat Jahangir Ravikanth Lakamsani Hoang Nguyen Didier Margairaz Zarin Said Yolanda Ventura Vega Rashid Iqbal Muse Semiconductor Mike Andrews, PMP #TSMC #TSMCOIP2026 #ExpandingAIWithLeadershipEcosystem

Yesterday was an incredible day at the TSMC 2026 North America OIP Ecosystem Forum! We had great conversations with fellow OIP ecosystem members and shared that GSME is TSMC's newest VCA partner. It was a real highlight to celebrate the deep collaboration across the OIP ecosystem that is accelerating AI development. Thank you to everyone who stopped by and connected with us. Let's keep working together to push the boundaries of AI through the OIP leadership ecosystem! TSMC Global Semiconductor Alliance Semiconductor Industry Association Farhat Jahangir Ravikanth Lakamsani Hoang Nguyen Didier Margairaz Zarin Said Yolanda Ventura Vega Rashid Iqbal Muse Semiconductor Mike Andrews, PMP #TSMC #TSMCOIP2026 #ExpandingAIWithLeadershipEcosystem