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Accelerating Chiplet Innovation with a New Partner Ecosystem The semiconductor industry is currently undergoing a massive shift. As we push the boundaries of performance in physical AI, data centers, and high-performance computing (HPC), traditional monolithic chip design is hitting physical and economic walls. The answer for many engineers and architects is chiplets, a modular approach that enables the mixing and matching of silicon dies to create powerful, highly customized systems... Read the Cadence Tech Talk article>> https://ow.ly/Q3OB50YWkXa

Silicon Creations Celebrates 20 Years of Global Growth and Leadership in 2nm IP Solutions Announcing next-generation clocking and sensing solutions in development on TSMC A14 Process... https://ow.ly/FqU150YOekz

Samsung Foundry and Cadence: Accelerating Chiplet Solutions for Physical AI Artificial Intelligence (AI) is rapidly expanding beyond digital environments and into the physical world. AI-driven systems that give machines the ability to perceive, comprehend, learn from, and respond to real-time environments are quickly moving from imagination to reality. Training and inference models are expanding rapidly, complex Systems on Chip (SoCs) are processing information at increasing speeds, and vision and sensor applications are creating a new generation of edge, industrial, and automotive solutions that interact more closely with the physical world... Read the Samsung Foundry blog>> https://ow.ly/3tRC50YOivk

Arteris Wins Stevie Award for Technology Innovation of the Year Arteris semiconductor cybersecurity assurance products recognized in the software category of The American Business Awards® https://ow.ly/kAn750YSABU

RISC-V IP Cores: Built for functional safety (ASIL-B/D), high performance, and low power operation for automotive and industrial applications https://ow.ly/m0Mi50Z2ovb

Cadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand Multi-year agreement expands Memory, NVIDIA NVLink-C2C and advanced Interface IP, and agentic AI-optimized GPU‑accelerated EDA and SDA flows on Samsung Foundry’s second-generation 2nm node for next-generation AI infrastructure and physical AI designs https://ow.ly/sntV50Z5pOi

SOS for Visual Studio Code: Design Data Management for Digital Design Teams Join our upcoming webinar to discover how the Keysight SOS extension for Visual Studio Code brings design data management directly into the editor digital teams already use. June 17th Register Now>> https://ow.ly/fz1F50Z5pmE

The Future of Chip Integration: Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer Level Milestone in the European APECS pilot line: Successful implementation of quasi-monolithic integration (QMI) https://ow.ly/5cfs50Z5pI9

Ask the Experts: The State of AI Rambus Expert, Steven Woo, discusses the latest developments in AI and the implications for hardware and computing architecture. Learn about chain-of-thought and the innovations needed to support its computational demands. https://ow.ly/mJFE50YWmNC

EXTOLL and Chip Interfaces unveil the Industry´s first UCIe IP Solution for GlobalFoundries FDX Technology https://ow.ly/4VBU50Z5pFB