Mannheim, Germany, May 28, 2026 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, and Chip Interfaces, a leading supplier of digital IP cores are proud to introduce the industry´s first integrated UCIe IP solution (PHY and D2D Adapter) for GlobalFoundries’ (GF) FDX™ technology.

The customer-ready offering is based on EXTOLL´s PHY and Chip Interfaces´ D2D Adapter, which comes as a pre-integrated and co-verified platform to unlock unprecedented end-to-end die-to-die connectivity for mainstream technology nodes.

“Building on a highly successful collaboration with Chip Interfaces and GlobalFoundries, we are thrilled to bring our customers a powerful, timely solution that accelerates and simplifies their transition to chiplet-based systems, unleashing new levels of innovation and performance.”, says Dirk Wieberneit, CEO of EXTOLL. “By combining the exceptional mixed-signal performance of GF’s FDX technology with EXTOLL’s leading-edge UCIe IP, we’re delivering real solutions for optimized chiplet-based systems that can evolve with the growing demand for faster, reliable and more secure connectivity.”

The IP is optimized for standard packaging, with full support for organic substrates across standard-defined bump pitch ranges. Designed and rigorously verified for interoperability, it empowers customers to develop differentiated systems based on the UCIe v2.0 standard.

The D2D Adapter for UCIe is a scalable layer between protocol components and the UCIe PHY, enabling efficient data transfer across the UCIe Link. It minimizes main data path logic for low-latency Flit transport and supports ARB/MUX functionality for multiple simultaneous protocols, including CXL. For Raw BER above 1e-27, it implements the UCIe-defined CRC and Retry scheme to ensure reliable transport for PCIe, CXL, Streaming, and other protocols.

“The D2D Adapter for UCIe combined with the UCIe PHY form a complete UCIe solution ready to support any protocol layer. The offering consists of two IP parts the D2D adapter from Chip Interfaces and the UCIe PHY from Extoll”, says Anne Voss Winther CEO of Chip Interfaces.” Chip Interfaces is happy to partner with Extoll on UCIe technology to create a complete solution for our customers.”

GF’s FDX platform offers superior RF/Mixed-Signal performance, power efficiency, and full System-on-Chip (SoC) integration to deliver compact, versatile solutions for always-on, intelligent and connected devices across a wide range of applications. The platform includes Auto Grade 1 qualification, and embedded non-volatile memory (eNVM) solutions, providing exceptional design flexibility and rugged reliability for technologies in the automotive, communications infrastructure and SATCOM markets. The FDX platform is manufactured at GF’s advanced facilities in New York and Germany, ensuring a geographically diverse and reliable supply chain for customers. radiation-hardness by design

“We are delighted to see EXTOLL, in partnership with Chip Interfaces, deliver the industry’s first integrated UCIe solution on our FDX platform that will unlock new capabilities for our customers designing advanced chiplets for next-generation systems spanning Physical AI, Edge AI, automotive, SATCOM and more,” said Sudipto Bose, vice president of product management for GF’s FDX technology.

The addressable market is broad, spanning Edge AI, Physical AI, robotics, aerospace and defense, as well as medical and automotive applications.

EXTOLL brings deep expertise in die-to-die connectivity. Its UCIe IP is a key building block for highly efficient chiplet-based architectures, complementing EXTOLL’s extensible Network-on-Chip (NoC) and SerDes IP portfolio.

About EXTOLL

EXTOLL, a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity, designs and develops semiconductor IP with the smallest footprints and highest PPA in the industry, serving the worldwide market of ASIC, SoC- and Chiplet-Makers in various segments. The portfolio provides customers with tailored solutions for their systems covering NoC (Network-on-Chip) and Die-to-Die interfaces.EXTOLL delivers innovative solutions to enable customers to successfully migrate into the Chiplet Age.

Find out more about our products and solutions – please visit us at www.extoll.com

About Chip Interfaces

Chip Interfaces is a leading provider of silicon-agnostic, customizable digital IP cores for next-generation applications. Its portfolio includes JESD204, MIPI, Interlaken, UCIe D2D, UAlink, DiFi, CPRI/eCPRI, and High-Speed Ethernet solutions, including MAC, PCS, and MACsec.

Through advanced verification, interoperability testing with leading PHY providers, and test-bed validation, Chip Interfaces helps customers simplify integration, reduce design risk, and accelerate time to market.

Find out more about our products and solutions – please visit us at www.chipinterfaces.com

This press release was originally published in EXTOLL press releases, located here

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