Semiconductor IP News and Trends Blog
Follow our semiconductor IP Insider blog section for up to date information on the latest technological advances in silicon IP
May 18, 2026 - By Sangeeta Soni
Explore Cadence IP here At the recent PCI‑SIG Developers Conference US held on May 6-7,2026, Cadence announced the availability of its PCIe Gen8 Verification IP (VIP)—taking another significant step in enabling early, confident adoption of the PCI Express roadmap. As PCIe continues … Continue reading
May 11, 2026 - By Hui Wu
Explore Cadence IP here The accelerated growth in data processing and storage demands across HPC datacenters and AI factories is expediting PCIe innovation as PCIe links form a foundational fabric for xPU and storage connectivity. While PCIe 6.x is now … Continue reading
April 24, 2026 - By Rambus News
Explore Rambus IP here At Rambus, we spend a lot of time solving hard problems at the intersection of memory and compute. Bandwidth limits. Power integrity. Signal integrity. Thermal constraints. These challenges become even more complex as AI training, inference, … Continue reading
April 22, 2026 - By Samsung Foundry
Artificial Intelligence (AI) is rapidly expanding beyond digital environments and into the physical world. AI-driven systems that give machines the ability to perceive, comprehend, learn from, and respond to real-time environments are quickly moving from imagination to reality. Training and … Continue reading
April 17, 2026 - By Veena Parthan
Explore Cadence IP here CadenceLIVE Silicon Valley 2026 has come to a close. What unfolded over the course of the event was a focused exploration of where semiconductor design is headed—one shaped by AI-driven workflows, advanced packaging, and system-level complexity. … Continue reading
April 16, 2026 - By Reela Samuel
Explore Cadence IP here Day 2 at CadenceLIVE Silicon Valley 2026 carried a different kind of momentum. If day 1 established the architectural shift, day 2 made it operational. Across morning and afternoon tracks, the conversation moved decisively from capability … Continue reading
April 16, 2026 - By Cadence Blog
Explore Cadence IP here One of the most thought-provoking discussions at CadenceLIVE centered on a challenge that sits at the heart of modern system innovation—how do we ensure that what works perfectly in simulation performs just as reliably in the … Continue reading
March 13, 2026 - By Tim Messegee
In the fast-paced world of Artificial Intelligence (AI), a groundbreaking startup is making waves with its innovative approach to AI chip design. Etched, founded by Harvard dropouts Gavin Uberti, Chris Zhu, and Robert Wachen in 2022, has set out to … Continue reading
March 6, 2026 - By Sriram Sharma Kalluri
The automotive industry has shifted its focus from traditional performance metrics to prioritizing safety and comfort. As vehicles evolve into software-defined environments, the interior cabin is emerging as a sanctuary—offering enhanced safety, superior comfort, and immersive high-fidelity entertainment for all … Continue reading
February 24, 2026 - By Tim Messegee
Post-Quantum Cryptography (PQC), also known as Quantum Safe Cryptography (QSC), refers to cryptographic algorithms designed to withstand attacks by quantum computers. Quantum computers will eventually become powerful enough to break public key-based cryptography, also known as asymmetric cryptography. Public key-based … Continue reading
February 5, 2026 - By Tim Messegee
A root of trust is the security foundation for an SoC, other semiconductor device or electronic system. However, its meaning differs depending on who you ask. From our perspective, the hardware root of trust contains the keys for cryptographic functions … Continue reading
January 15, 2026 - By Tim Messegee
With the ongoing efforts of the Rambus engineering team, we have now achieved compliance to CXL 2.0 with our CXL Controller IP, and it has been added to the Integrators List. We’ll keep you posted on future progress as we … Continue reading
December 24, 2025 - By Steven Woo
On this episode of Ask the Experts, we had the opportunity to chat with Steven Woo, Rambus Fellow & Distinguished Inventor, about the latest developments in AI and the implications for hardware and computing architecture. Specifically, he discussed the exciting … Continue reading
December 11, 2025 - By Cadence Blog
Since their debut in 2023, AI PCs have taken the market by storm. Gartner projects that 77 million AI PCs will ship in 2025, representing 31% of the worldwide PC market, and growing to a 55% market share in 2026. … Continue reading
December 3, 2025 - By Parvez Shaik
On this episode of Ask the Experts, we sat down with Parvez Shaik, a Rambus security expert, about the latest developments in security and the concept of the root of trust. Scroll below to watch this episode and learn about … Continue reading
October 24, 2025 - By Bart Stevens
Explore Rambus IP here The cybersecurity threat landscape is dynamic and rapidly evolving. Indeed, attackers are constantly finding new ways to exploit critical vulnerabilities across a wide range of applications and devices. Protecting data and devices requires secure processes running … Continue reading
October 8, 2025 - By Sheryl Gulizia
Explore Cadence’s 224G-LR SerDes PHY As AI workloads grow in scale and complexity, networks are challenged to keep up. According to McKinsey & Company, global demand for data center capacity is projected to nearly triple by 2030, with AI workloads … Continue reading
September 25, 2025 - By Tim Messegee
Explore Rambus IP here From the first monochrome mobile displays to today’s ultra-high-definition automotive dashboards and immersive AR/VR headsets, MIPI technology has quietly become the backbone of modern data connectivity. Let’s explore how MIPI standards have evolved, the markets they … Continue reading
September 16, 2025 - By Joe Chen
Learn more about Cadence key AI solutions (HBM, UCIe, UALink, and more). AI is driving a new semiconductor renaissance—it’s no longer just a workload, but the defining force behind a new era of semiconductor innovation. Cadence Fellow Charles Alpert echoed this message in … Continue reading
August 28, 2025 - By Tim Messegee
Explore Rambus IP here In this blog post, we explore everything you need to know about Graphics Double Data Rate, most commonly known as GDDR. Since its introduction in 2000, GDDR has become the primary memory technology for graphics cards, … Continue reading
August 1, 2025 - By Gautam Singampalli
FMS: the Future of Memory and Storage is fast approaching (August 5-7 at the Santa Clara Convention Center), and with it comes a unique opportunity to connect with some of the brightest minds in the semiconductor, memory, and storage industry. … Continue reading
September 9, 2024 - By Nidish Kamath
To coincide with the launch of the industry’s first HBM4 Controller IP from Rambus, we talked to Nidish Kamath, Director of Product Management for Memory Interface IP. The discussion highlighted how AI applications are driving the increased demand for HBM-based … Continue reading
September 2, 2024 - By Mike Gianfagna
The Universal Chiplet Interconnect Express™ (UCIe™) 1.0 specification was announced in early 2022 and a UCIe 1.1 update was released on August 8, 2023. This open standard facilitates the heterogeneous integration of die-to-die link interconnects within the same package. This … Continue reading
August 6, 2024 - By Frank Ferro
The rapid rise in size and sophistication of AI/ML training models requires increasingly powerful hardware deployed in the data center and at the network edge. This growth in complexity and data stresses the existing infrastructure, driving the need for new … Continue reading
July 25, 2024 - By Kalar Rajendiran
The rapid expansion of data-intensive applications, such as artificial intelligence (AI), high-performance computing (HPC), and 5G, necessitates connectivity solutions capable of handling massive amounts of data with high efficiency and reliability. The advent of 224G/112G Serializer/Deserializer (SerDes) technology, utilizing PAM4 … Continue reading
June 11, 2024 - By Gautam Singampalli
PCI-SIG DevCon 2024 – 32nd Anniversary For more than a decade, Cadence has been well-known in the industry for its strong commitment and support for PCIe technology. We recognize the importance of ensuring a robust PCIe ecosystem and appreciate the … Continue reading
May 28, 2024 - By Shyam Sharma
Low-power DDR (LPDDR ) SDRAM has been one of the most widely used memories in the semiconductor market today. It is used in a diverse set of applications that span mobile/handheld devices, IoT, client and server, automotive, virtual reality/gaming consoles, … Continue reading
April 26, 2024 - By Arif Khan
LEGO® is the world’s most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We … Continue reading
February 28, 2024 - By Mayank Bhatnagar
Cadence demonstrated multiple IP for die-to-die connectivity at Chiplet Summit 2024. Conference attendees discussed their chiplet and multi-die design needs with our experts and learned how Cadence’s IP can support them in achieving their system needs with optimum PPA targets. … Continue reading
February 28, 2024 - By Neha Joshi
The ultimate goal of the Cadence Genus Synthesis Solution is very simple: deliver the best possible productivity and Power, Performance, and Area (PPA) during register-transfer-level (RTL) logic synthesis. The real design synthesis journey is not always rosy; there might be … Continue reading
February 1, 2024 - By Ben Gu
It’s no secret that the automotive industry is constantly evolving. From the newest models to the latest technology, there’s always something exciting happening in this area. One of the most interesting developments in recent years has been the use of … Continue reading
January 17, 2024 - By Veena Parthan
From the classic Model T to the iconic American muscle cars, the design of cars has been shaped by many factors over the years. Technological advancements, consumer preferences, and government regulations have all played their part. But one factor that … Continue reading
January 8, 2024 - By Neha Joshi
Traditionally, you would do power, performance, area, and congestion (PPAC) analysis for a design as you move forward with different stages in the flow. But with highly advanced technology, the real designs are getting complex and interdependent, complicating the analysis … Continue reading
December 19, 2023 - By Pratul Nijhawan
This two-day training course focuses on transient noise simulations using the Spectre simulator inside the Virtuoso Analog Design Environment (ADE) Suite. The course is characterized in the following modules: Introduction to transient noise analysis: In this introductory module of the … Continue reading
December 15, 2023 - By Joey Lee
Embedded non-volatile memory (eNVM) is a vital element in modern electronic devices as a storage solution that retains data even when power is turned off. Aside from existing non-volatile memory technology like One-Time-Programmable memory (OTP), Multiple-Time-Programmable memory (MTP) and Flash … Continue reading
December 14, 2023 - By Sangeetha Sukumaran
While RF circuits might appear complex at first glance, with the right tools, you can incorporate RF designs into your PCB projects effortlessly and confidently. This blog post will delve deep into the AWR Microwave Office to Allegro RF Design … Continue reading
December 13, 2023 - By Danielle Gibson
When it comes to meeting the expectations surrounding uptime, capacity utilization, and energy efficiency, many data center operators are finding themselves in a relentless cycle of firefighting issues as they arise. Manual processes often aren’t enough to counteract this reactive … Continue reading
December 13, 2023 - By Claire Ying
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our One Cadence—One Team culture and the importance of sustaining it as we learn from diverse perspectives. “Alone we can do so little; together we … Continue reading
December 12, 2023 - By Sandeep Onkaraiah
Advanced node technologies require specific layout designs due to their complicated manufacturing process. These designs have strict device placement and additional constraints, necessitating multiple masks for a single layer on the wafer. A row-based methodology using Snap Patterns (SPs), Width … Continue reading
December 12, 2023 - By Tracy Fox
DisplayPort is a digital display interface developed by the Video Electronics Standards Association (VESA) for connecting a video source to a display device. It is known for its high bandwidth and support for high resolutions, refresh rates, and color depths. … Continue reading
December 11, 2023 - By Niyati Singh
The Spectre FMC Analysis uses advanced statistical and machine learning (ML) techniques to achieve the right statistical accuracy with the minimum number of Monte Carlo simulations. It works with the Spectre X and Spectre APS Simulators and allows you to … Continue reading
December 7, 2023 - By Krishna Atreya
Semiconductor chips must be designed faster, smaller, and smarter—with less manual work, more automation, and faster production. The Training Webinar “Flow Wrapping: The Cadence Cerebrus Intelligent Chip Explorer Must Have” was recently hosted with me, Krishna Atreya, Principal Education Application … Continue reading
December 7, 2023 - By Jasmine A
The System Analysis Knowledge Bytes blog series explores the capabilities and potential of the System Analysis tools offered by Cadence. In addition to providing insight into the useful features and enhancements in this area, this series aims to broadcast the … Continue reading
December 6, 2023 - By Sakshi Nema
Watch the Cadence Training Webinar: IR-Aware ECO Optimization using Voltus and Tempus Solutions The Cadence Voltus IC Power Integrity Solution integrates with the Cadence Tempus Timing Signoff Solution to provide the fastest design analysis and closure with increased accuracy. Deep dive … Continue reading
December 1, 2023 - By Shubham Sharma
Why is Design for Testability (DFT) crucial for VLSI (Very Large Scale Integration) design? Keeping testability in mind when developing a chip makes it simpler to find structural flaws in the chip and make necessary design corrections before the product … Continue reading
November 30, 2023 - By Candy Yu
Cadence is awarded a second time for driving the development of the Taiwan semiconductor industry Cadence Design Systems, Inc. announced that it has won the 2023 International Partner Office (IPO) Award, “Soft Value Partners” category, from the Ministry of Economic … Continue reading
November 30, 2023 - By Andre Baguenier
Cadence Spectre AMS Designer is a high-performance mixed-signal simulation system. The ability to use multiple engines and drive from a variety of platforms enables you to “rev up” your mixed-signal design verification and take the checkered flag in the race … Continue reading
November 30, 2023 - By Rajneesh Chauhan
In the rapidly evolving landscape of data centers, ensuring cache coherence in multi-host environments is imperative. The Compute Express Link (CXL) 3.0 specification introduces a robust mechanism known as the Back-Invalidate feature to uphold cache coherence across multiple hosts and … Continue reading
November 30, 2023 - By Mark Seymour
No one wants to waste unnecessary time in the model creation phase when using a modeling software. Rather than expect users to spend time trawling for published data and tediously model equipment items one by one from scratch, modeling software … Continue reading
November 28, 2023 - By Rohini Garg
Our new AI-powered custom design solution, Virtuoso Studio, leverages our 30 years of industry knowledge and leadership, providing innovative features, reimagined infrastructure for unrivaled productivity, and new levels of integration that stretch beyond classic design boundaries. In this blog series, … Continue reading
November 28, 2023 - By Abha Rawat
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our One Team culture at Cadence. In the DEI@Cadence blog series, you’ll hear the many unique perspectives and experiences of our global employees. In today’s … Continue reading
November 23, 2023 - By Krunal Patel
In the ever-expanding domain of interconnected devices and digital communication, ensuring the security of data transmission has become paramount. One robust solution that stands at the forefront is the integration of IPSec with ethernet. Internet Protocol Security (IPSec) operates at … Continue reading
November 20, 2023 - By Candy Yu
Cadence Design Systems, Inc. announced that it has won the Top 10 Foreign Sustainable Model Companies Award from Taiwan Institute for Sustainable Energy (TAISE) for its continuous efforts in promoting Taiwan’s sustainability by enabling electronic designs. The award ceremony of … Continue reading
November 17, 2023 - By Anand Dharmalingam
Identifying critical DFM issues late in the design cycle can result in a complete rework of your PCB layout. Missing critical manufacturing rules can lead to the board being scrapped, costly rework, and time-to-market delays. Allegro DesignTrue DFM technology adds … Continue reading
November 17, 2023 - By Veena Parthan
In the ninth edition of the Women in CFD series, we are excited to feature Sainan Lu, lead product engineer for the Cadence Celsius Thermal and Celsius EC Solver. Her remarkable career journey in the field of computational fluid dynamics … Continue reading
November 17, 2023 - By Cadence Blog
What is model-based systems engineering (MBSE)? How does it contribute to the engineering design process? The MBSE approach to system design focuses on creating and using models to define and visualize the system architecture, requirements, behavior, and other aspects. It’s … Continue reading
November 13, 2023 - By Danielle Gibson
Digital transformation, or the process of replacing standard or manual business procedures with digital counterparts, is fundamental to scalable operations in the digital era. The process of integrating digital technology into all business areas comes with distinct challenges and noticeable … Continue reading
November 13, 2023 - By Pamula Sai Srinivas
Would you like to know how to design a complete chip using the RTL-to-GDSII flow? Please join me, Cadence Training and application engineer Sai Srinivas Pamula, for this free technical Training Webinar, RTL-to-GDSII Flow for ASIC Design Using Cadence Tools. … Continue reading
November 8, 2023 - By Jasmine A
The System Analysis Knowledge Bytes blog series explores the capabilities and potential of the System Analysis tools offered by Cadence. In addition to providing insight into the useful features and enhancements in this area, this series aims to broadcast the … Continue reading
November 7, 2023 - By Bahadir Erimli
One hot August day in Tempe, Arizona, my wife LeAnn and I were sitting with our younger daughter, Bria, in the pleasant front courtyard of the freshman engineering dorm at Arizona State University, Bria’s new home for that year. LeAnn … Continue reading
November 7, 2023 - By Sue Hung Fung
Intel and Cadence are collaborating on an initiative to demonstrate interoperability between Intel’s UCIe IP and Cadence’s UCIe IP. UCIe is the latest emerging open specification defining the interconnect between two die links in a system in package (SiP). UCIe … Continue reading
November 6, 2023 - By Reela Samuel
Chip engineers, the unsung heroes of the tech world, lead a secret life at work that’s more mysterious than a spy novel. They huddle around schematics like wizards around a cauldron, whispering incantations in the language of transistors. Well, for … Continue reading
October 17, 2023 - By Steve Brown
We are excited to announce that the Performance Cookbook for Arm is now available! In the rapidly evolving world of technology, Arm®-based system-on-chip (SoC) designs have become a cornerstone. As the complexity and performance demands of these designs increase, so … Continue reading
October 10, 2023 - By Philipp Jacobsohn
Considerations for ensuring functional safety in safety-critical applications during implementation and verification of IP cores Companies that are active in the field of creating products with special requirements for functional safety often request certification of third-party components, such as IP … Continue reading
October 4, 2023 - By Krunal Patel
The evolution of technology has led to a rapid increase in data transmission over Ethernet networks. With this growth comes the need for robust security measures to protect sensitive information. In this blog post, we will delve into MACsec, a … Continue reading
October 4, 2023 - By Brandon Loguercio
Trilinear Technologies’ latest – DisplayPort 2.1 Challenges of delivering today’s most innovative display solution while accelerating your time to market Since the advent of VESA’s first DisplayPort standard in 2006, Trilinear has been at the forefront of cutting-edge DisplayPort IP … Continue reading
September 28, 2023 - By Sue Hung Fung
Cadence has become a contributor-level member of the Automotive Working Group in the Universal Chiplet Interconnect Express (UCIe) Consortium. Last year, the Consortium ratified the UCIe specification, which was established to standardize a die-to-die interconnect for chiplet components from multiple … Continue reading
July 26, 2023 - By Mamta Rana
As the data rate increases in PCIe 6.0, so do the challenges. If we talk in terms of credits, higher data rate means more credits consumed. Today, as the designs are getting complex, the need to have more credits arises. … Continue reading
July 13, 2023 - By Raquel Perez
Cadence announced Joules RTL Design Studio today at CadenceLIVE Japan 2023, a new product that expands upon Cadence’s existing Joules RTL Power Solution. The solution will address all aspects of physical design by adding visibility beyond just power into performance, … Continue reading
June 16, 2023 - By Gary Ruggles
If you dream of networking at the speed of the latest 800G Ethernet, you’ll need a serial bus interface to match it. Data center solid state drives (SSDs) and the accelerators used in AI applications are also hungry for speed. … Continue reading
April 17, 2023 - By Lj Chen
Have you ever really stopped to think about how truly amazing your smartphone is? From our handheld devices, we can plan dinner out with friends, hail a ride to the restaurant, watch videos or play online games while en route, … Continue reading
April 13, 2023 - By Tanushri Shah
The “Designed with Cadence” series now has a podcast, and it’s all about cutting-edge technology and innovation across the EDA industry. Hosted by Jeff Applebaum of Cadence, each episode will feature various industry leaders from Cadence discussing the latest trends … Continue reading
April 10, 2023 - By Dana Neustadter
Man-in-the-middle attacks. Eavesdropping. Denial of service. Privilege escalation. In Ethernet network breaches like these, the bad people are after data, one of the most valuable currencies of our time. As technology advances, our world becomes more interconnected, every device becomes … Continue reading
April 6, 2023 - By Tanushri Shah
Hermeus is a company that’s looking to radically accelerate air travel. For the past four years, they’ve been developing hypersonic vehicles and are coming up with concepts that make air travel between New York and London take around 90 minutes. … Continue reading
March 20, 2023 - By Dana Neustadter
Dana Neustadter Brett Murdock Synopsys In 2017, the credit bureau Equifax announced that hackers had breached its system, unleashing the personal information of 147 million people. As a result, the company has settled a class action suit for $425 million … Continue reading
March 2, 2023 - By Richard Solomon
PCI Express® (PCIe®) is the most widely adopted and extensible interconnect technology in history. As the leading supplier of IP solutions for PCIe, I am thrilled to announce that Synopsys IP solutions for PCIe 5.0, including digital controllers and PHYs, … Continue reading
February 28, 2023 - By Anunay Bajaj
UCIe or Universal Chiplet Interconnect Express is the fastest growing chiplet interconnect standard that enables a future where a catalog of chiplets will be available to mix and match based on the chip designs in the sphere of AI, network … Continue reading
February 21, 2023 - By Gary Ruggles
Our digital world is swimming in data, and the faster the data gets transferred from one point to another, the better performance you’ll see from an array of applications, like the metaverse, with its enriching interactions. Another example is big … Continue reading
February 8, 2023 - By Richard Solomon
In the beginning of electronic data management, data was relatively secure. After all, you owned all the hardware. The data servers were on premise. The person sitting in front of the computer was your trusted employee. And of course, you … Continue reading
January 26, 2023 - By Paul Mclellan
NASA needs a new computer. Being NASA, of course, this has an acronym, HPSC. Unusually for NASA, this has four letters, not three. Remember back in the Apollo program (assuming you were born) when we all knew what TLI, LEM, … Continue reading
January 25, 2023 - By Krunal Patel
Efficient and flexible use of bandwidth is the key to optimizing traffic flow for any communication channel, and so for Ethernet. FlexE (Flex Ethernet) is a standard developed by the Optical Internetworking Forum (OIF) that allows for efficient and flexible … Continue reading
January 24, 2023 - By Rahul Thukral
By Rahul Thukral and Bhavana Chaurasia Synopsys Our intelligent, interconnected, data-driven world demands more computation and capacity. Consider the variety of smart applications we now have. Cars can transport passengers to their destinations using local and remote AI decision making. … Continue reading
January 18, 2023 - By Sangeeta Soni
2023 is here, and technology trends around Compute Express Link (CXL) and the next generation of AMBA protocols (CHI-E/F) are getting more traction. The biggest challenge of today is the complexity of handling enormous data flow owning to AI, ML, … Continue reading
January 16, 2023 - By Sanjeet Kumar
USB Promoter Group recently released USB4 Version 2.0 and this updated specification extends USB4 speed and data protocol performance, enabling manufacturers to develop products that can deliver up to 80 Gbps of data performance over the USB Type-C® cable and … Continue reading
January 13, 2023 - By Shyam Sharma
DDR5 is the latest generation of the DDR server memory capable of supporting data rates of up to 8800 Mbps which is quite a leap over previous generations of DDR memories. It is used in a wide variety of applications … Continue reading
January 12, 2023 - By Harshit Jaiswal
Universal Chiplet Interconnect Express (UCIe) is a novel specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. What Is a Chiplet? A chiplet is a tiny integrated … Continue reading
December 19, 2022 - By Mamta Rana
The Link equalization procedure enables components to adjust the Transmitter and the Receiver setup of each Lane to improve the signal quality and meet the requirements, when operating at 8.0 GT/s and higher data rates. All the Lanes that are … Continue reading
December 18, 2022 - By Yeshavanth B N
SD Host Controller was introduced to transfer data to SD Card from system memory and vice versa. It also is the standard controller to manage the SD Card (SD Memory and SDIO). SD Association (SDA) maintains guidelines for designing SD … Continue reading
December 6, 2022 - By Dana Neustadter
What do stock option pricing, drug discovery, and fraud detection have in common? They are among a growing number of applications that rely on rapid, precise calculations performed on massive volumes of data to uncover actionable insights. As powerful as … Continue reading
October 31, 2022 - By Mamta Rana
With new PCIe 6.0 Base specifications rolled out, the move from NRZ (non-return-to-zero) to PAM4 (4-Level Pulse Amplitude Modulation) is no surprise. To address the Nyquist frequency issues at 64GT/s, which doubles to 32GHz which further causes frequency dependent loss … Continue reading
October 27, 2022 - By Sangeeta Soni
PCIe designed system fabrics rely on software enumeration by Operating System (OS) for device discovery. CXL 2.0 device is exposed as PCIe native endpoint and CXL 1.1 is exposed as root complex integrated endpoints (RCiEP) during software enumeration process. Notably, … Continue reading
October 24, 2022 - By Tracy Fox
USB4 is an industry standard that tunnels three different protocol specifications (PCIe, USB3 and DisplayPort) serially to a destination. DisplayPort (DP) tunneling over USB4 means DP protocol packets are converted into USB4 protocol packets and transferred over its fabric to … Continue reading
October 21, 2022 - By Mamta Rana
Lane Margining which was introduced in PCIe 4.0 and has been a very important technology since then. With the doubling of the bandwidth from 8 GT/s to 16 GT/s per Lane in formulating the PCIe 4.0 specifications, there arises the … Continue reading
October 19, 2022 - By Neelabh Singh
USB4 Version 2.0 specification was recently released by the USB Promoter Group. This specification enables up to 80 Gbps link speed per direction in symmetric mode, and up to 120 Gbps link speed in asymmetric mode. It has new feature … Continue reading
October 17, 2022 - By Xin Mu
The PCIe 6.0 Specification released in 2021 doubles the performance to 64GT/s transfer rate with PAM4 (Pulse Amplitude Modulation with 4 levels) modulation and uses FLIT (Flow Control Unit) as the unit of communication for efficiency. In ‘What Disruptive Changes … Continue reading
October 14, 2022 - By Xin Mu
The PCIe 6.0 Specification released in 2021 doubles the performance to 64GT/s transfer rate with PAM4 (Pulse Amplitude Modulation with 4 levels) modulation and uses FLIT (Flow Control Unit) as the unit of communication for efficiency. In What Disruptive Changes … Continue reading
October 12, 2022 - By Ayush Kumar
Media Independent Interface Management (MIIM), or Management Data Input/Output (MDIO), is a serial bus protocol and is used for the IEEE 802.3 Ethernet standard and Media Independent Interface (MII). The MIIM/MDIO protocol is a simple two-wire serial interface with specific … Continue reading
October 12, 2022 - By Xin Mu
The PCIe 6.0 Specification released in 2021 doubles the performance to 64GT/s transfer rate with PAM4 (Pulse Amplitude Modulation with 4 levels) modulation and uses FLIT (Flow Control Unit) as the unit of communication for efficiency. In ‘What Disruptive Changes … Continue reading
October 10, 2022 - By Neelabh Singh
USB Promoter Group has announced the pending release of the USB4® Version 2.0 specification, which will enable up to 80 Gbps operation over the USB Type-C® cable and connector. As per this announcement, the key characteristics of the updated USB4 … Continue reading
October 5, 2022 - By Dana Neustadter
Due to today’s connected world, a high volume of valuable data, susceptible to tampering and physical attacks, is processed, stored, and moved between devices, cars, and data centers. And the number of connections continues to grow. Even with supply chain … Continue reading
September 28, 2022 - By Nir Shapira
What is Open RAN? 5G infrastructure build-out is happening but we’re still early on the growth curve. It started strong in China and is now picking up in North America and Europe. Equipment today is dominated by five Tier 1 … Continue reading
September 26, 2022 - By Anshul Shah
One of the key goals for USB4 is to retain compatibility with the existing ecosystem of USB3.2, USB 2.0 and Thunderbolt™ products, and the resulting connection scales to the best mutual capability of the devices being connected. USB4 is designed … Continue reading
September 11, 2022 - By Vedansh Seth
In a network containing multiple nodes, the need for synchronization between the various nodes is not just instrumental but also a complicated and highly complex process. This process becomes even more tricky if we synchronize the clocks between the Manager … Continue reading
August 31, 2022 - By Gaurav Jain
NAND Flash memory is now a widely accepted non-volatile memory in many application areas for data storage such as digital cameras, USB drive, SSD and smartphones. One form of NAND flash memory, Toggle NAND, was introduced to transmit high-speed data … Continue reading
July 13, 2022 - By Franz Dugand
Ever since the WiFi Alliance was formed in 1999, WiFi technology has continuously evolved to serve the ever-growing demand for higher throughput and higher number of devices, with an alphabet-challenging series of version names. It became so popular that it … Continue reading
July 7, 2022 - By Krunal Patel
The automotive industry is going through disruptive transformations owing to recent trends in comfort, connectivity, autonomous driving, security, and infotainment. Car manufacturers kept adding more and more sensors and electronic control units (ECUs) to enhance autonomy, safety, connectivity, and driving … Continue reading
July 6, 2022 - By Shyam Sharma
With the DRAM fabrication advancing from 1x to 1y to 1z and further to 1a, 1b and 1c nodes along with the DRAM device speeds going up to 8533 for Lpddr5/8800 for DDR5, Data integrity is becoming a really important … Continue reading
June 8, 2022 - By Franz Dugand
My friend and I are at the airport, sitting in the waiting room next to the boarding gate, looking forward to our trip to Paris and the concert. We are debating past concerts, so I pull out my tablet and … Continue reading
May 13, 2022 - By Sangeeta Soni
If you have worked with Peripheral Component Interconnect Express (PCIe) in the past, you might have heard Compute Link Express (CXL) is break-through technology for modern day compute requirements driven by high-performance computing, cloud, AI and ML. Of course, CXL … Continue reading
April 29, 2022 - By Dimitry Pavlovsky
As discussed in the last installment of the blog, a robust system level scoreboard is essential for functional verification and performance validation of modern SoCs. A properly architected system scoreboard should work in conjunction with interface Verification IPs (VIPs) and … Continue reading
April 22, 2022 - By Yeshavanth B N
In ARM MMU-based systems, DTI protocol defines a standard way to communicate with Translation Control Unit (TCU). DTI protocol is a point-to-point protocol with each channel defining a link. The communication with TCU will be from two different components, and … Continue reading
April 12, 2022 - By Shyam Sharma
As the device frequencies and the data rates go up with every new generation of Interface and memory devices, sampling of the signals and the transferring of the data b/w Initiator and target is being increasingly difficult with ever shrinking … Continue reading
March 29, 2022 - By Salehabibi Shaikh
DDR Memory is an important part of a wide array of electronic system designs in various verticals like Data centers, Cloud computing, Aero-Defense, Mobile, or any other consumer devices. These industries continue to demand higher throughput, energy efficiency, low cost, … Continue reading
March 23, 2022 - By Gil Abraham
AI is becoming an increasingly popular technology, finding uses in more and more applications in sectors such as automotive, vision processing, and telecoms. AI is enabling new capabilities and replacing many conventional algorithms, for example to provide de-noising and image … Continue reading
March 17, 2022 - By Krunal Patel
Cloud computing, IoT (Internet of Things), machine learning, big data, and data centers are a few of those buzzwords levitating around digital transformation in recent years and we are quite familiar with these terms. These technologies have much of a … Continue reading
February 18, 2022 - By Neelabh Singh
The objective of USB4 protocol to achieve high speed signal transmission and thereby providing high data bandwidths for protocol tunneling would not have been possible without USB4 re-timer. Like several other serial protocols where the generation-by-generation higher link speeds are … Continue reading
January 25, 2022 - By Gil Abraham
Have we settled for what we think is possible in AI at the edge, rather than what we really want? Performance through novel architectures for cloud datacenter AI seems unbounded – why can’t edge AI also make quantum leaps in … Continue reading
January 24, 2022 - By Min Lei
In my previous article (From AMBA ACE to CHI, Why Move for Coherency?) I talked about how coherency needs have evolved from AMBA ACE to the highly successful and widely adopted CHI architecture. Since the introduction of CHI, Arm has … Continue reading
December 23, 2021 - By Jon Jacobsen
Interview with the CEO at Silex Insight – Michel Van Maercke Recently, the news landed in your mailbox that Silex Insight has sold its video division to Australian expert Audinate. We sat down and talked with Silex Insight’s CEO Michel … Continue reading
December 10, 2021 - By Krunal Patel
The emerging 5G network is the 5th generation of the cellular network. A 5G network allows handling a thousand times more traffic than today’s networks. Not only is it faster than the 4G network, but it also has lower latency, faster … Continue reading
November 9, 2021 - By Bipul Talukdar
A well-repeated truism throughout the semiconductor industry is that chip design verification is complex and often takes up the largest portion of a design project’s schedule –– sometimes as much as 70% –– and an ongoing challenge facing verification engineers. … Continue reading
October 28, 2021 - By Krunal Patel
At a particular point in time, the automotive industry continued to add more and more sensors and electronic control units to vehicles. All these sensors and actuators used to connect through CAN and LIN buses. However, since the introduction of … Continue reading
October 11, 2021 - By Shyam Sharma
Even with the DRAM capacity going up with each generation of DRAM, the demand for memory densities by variety of applications, is growing at even faster rate. To support these high memory densities and bus width requirements (that are typically … Continue reading
September 22, 2021 - By Sangeeta Soni
The concept of Trusted Execution Environments (TEE) was developed in the early 2000s to standardize key encryptions, end-to-end security and authenticity, and confidentiality of devices in a system. With the increase in computing and connected devices due to IoT, there … Continue reading
August 20, 2021 - By Thomas Wong
DesignCon 2021, Drive World Conference, and Embedded Systems Conference are a joint event this year. Cadence had an opportunity to present at a session on behalf of PCI-SIG. The topic of the presentation is “PCI Express Technology: Accelerating Automotive Connectivity, … Continue reading
August 9, 2021 - By Sriram Sharma Kalluri
Embedded Security Using Cryptography In the previous blog post, “Securing Offload Engines for a Robust Secure SoC System,” we briefly looked at some of the methods employed for achieving embedded security, i.e., cryptography, hardware partitioning and isolation, and hardware root … Continue reading
July 20, 2021 - By Dimitry Pavlovsky
Many of today’s SoCs are built around multi-layered, sophisticated interconnect IP components that link together multiple processor cores, caches, memories, and dozens of other IP blocks. These interconnects are enabling new generations of data servers and high-performance mobile devices. Being … Continue reading
July 19, 2021 - By Claire Ying
The new cloud, AI, Analytics, and Edge usage models with exponential data growth and connection drive the evolution of high-bandwidth PCIe (Peripheral Component Interconnect Express) version 5.0 and 6.0, CXL (Computer Express Link) version 2.0 and 3.0. Every component can … Continue reading
July 1, 2021 - By Sriram Sharma Kalluri
Protecting offload engines requires both software and hardware solutions. Welcome to the Securing Offload Engines blog series where we will explore different approaches to security implementations and look at system examples involving Cadence Tensilica Xtensa Processors. In this blog, we … Continue reading
June 1, 2021 - By Dimitry Pavlovsky
As discussed in the previous blog, the AMBA® 5 specification updates introduced several performance improvement features which align the AMBA5 ACE/AXI protocol with AMBA® 5 CHI (Coherent Hub Interface) specification. Among them is a new class of atomic transactions which … Continue reading
November 12, 2020 - By Roddy Urquhart
The area of any part of a design contributes both to the silicon cost and to the power consumption. A simplistic following of the “A” in a processor IP vendor’s PPA numbers can be misleading. A processor is never in isolation but … Continue reading
October 14, 2020 - By Dr. Evans Yang
Artificial intelligence will play a pivotal role in the future of information security. By combining big data, deep learning, and machine learning, AI give machines life; they can imitate human learning, replicate work behaviors, and bring new ways to operate … Continue reading
April 30, 2019 - By Paul Mclellan
I’ve said for a couple of years that high-end automotive companies are going to have to do what the high-end mobile companies did, and build their own application processors. It will be the only way for them to get differentiation … Continue reading
