SUSS

The conference season is in full swing – and we're bringing our expertise to three events in June, from Berlin to Stockholm to Grenoble. At the 𝗡𝗜𝗟 𝗜𝗻𝗱𝘂𝘀𝘁𝗿𝗶𝗮𝗹 𝗗𝗮𝘆 in Berlin (June 1–2), our colleague Oliver Kopp will take the stage to explore how inkjet resist with intrinsic adhesion enables precise nanopatterning of silicon nitride. It’s a technique that opens new doors for next-generation microstructuring processes. Just a week later, Philippe Muller heads to 𝗡𝗼𝗿𝗱𝗽𝗮𝗰 in Stockholm (June 9–11) to shed light on a highly relevant topic for the community: UV assisted curing for indium-based low melting point µBumps. This process innovation addresses real challenges in advanced packaging for quantum applications. And to sum everything up, we will present ourselves together with our partner Electron mec at the 𝗖𝗘𝗔 𝗟𝗲𝘁𝗶 𝗗𝗮𝘆𝘀 in Grenoble (June 23–25). Three events, three opportunities to exchange ideas, deepen partnerships, and shape what comes next – together. Attending any of these? We'd love to connect. #SUSS #Semiconductor #GrowingInnovation  

We’ve had an internal debate: Do we celebrate 15,000 followers on LinkedIn – or is that just a number? But then we realized: it’s a number that reflects the interest in our company and the semiconductor industry. A number that honors the expertise of our teams and the work happening across SUSS. Because it’s the company culture we live and the innovation our colleagues drive every day that make our stories worth telling. Last, but not least, this number represents you: everyone who chooses to follow along, challenge ideas, and stay curious with us. So, yes, there is reason to celebrate 🎉. Thank you for being part of our journey! 💡PS: Wonder what the picture shows? It’s a photomask, ready to be processed in one of our high-class platforms for photomask cleaning, baking, and developing. #SUSS #Semiconductor #GrowingInnovation

𝗗𝗿𝗶𝘃𝗶𝗻𝗴 𝘀𝗲𝗿𝘃𝗶𝗰𝗲 𝗳𝗼𝗿𝘄𝗮𝗿𝗱 𝘁𝗼𝗴𝗲𝘁𝗵𝗲𝗿. Join SUSS and help ensure nonstop high performance for our customers worldwide. As part of our global service team, you will support high-precision systems directly at customer sites, take responsibility from day one and work in one of the most exciting industries of the future: the semiconductor industry. Find more details about the job on our career site (link in comments). #SUSS #Semiconductor #GrowingInnovation #BreakingBarriersTogether

At the 𝗜𝗦𝗜𝗚 𝗘𝘅𝗲𝗰𝘂𝘁𝗶𝘃𝗲 𝗦𝘂𝗺𝗺𝗶𝘁 𝗧𝗮𝗶𝘄𝗮𝗻 𝟮𝟬𝟮𝟲, we saw firsthand how AI is reshaping the semiconductor landscape – fast, and across the full value chain. Our colleagues Dr. Robert Wanninger (Senior VP Advanced Backend Solutions) and Albert Chen (Managing Director Business Taiwan) joined this global platform for semiconductor executives and technology leaders. They brought back three key takeaways: ➡️ The semiconductor ecosystem is moving closer together. IDMs, foundries, equipment and material suppliers, and academia are aligning more tightly to improve scalability and accelerate execution. ➡️ Co-Packaged Optics (CPO) is gaining momentum. By integrating optics closer to compute, CPO enables higher data transmission without relying solely on further electrical scaling. ➡️ Frontend and backend boundaries are blurring. Progress is no longer just about smaller nodes. It is increasingly about smarter integration. A point that Robert also emphasized in his presentation. In his talk, “Paving the Way for Next‑Generation HBMs: From Low‑TTV Temporary Bonding & Debonding to Face‑to‑Back W2W Hybrid Bonding,” Robert highlighted the role of advanced 3D packaging and heterogeneous integration, including the need to balance performance, scale, and economics – and shared examples of how SUSS solutions help enable next-generation HBMs. Thank you to everyone at the ISIG Executive Summit 2026 for the strong exchange. These conversations help us keep turning innovation into scalable manufacturing solutions. #SUSS #Semiconductor #GrowingInnovation Images: Courtesy of ISIG

Team spirit on and off the track: a strong SUSS team lined up at the start of 𝗕𝟮𝗥𝘂𝗻 𝗞𝗮𝗿𝗹𝘀𝗿𝘂𝗵𝗲. 🏃 With 40 registered colleagues across departments, we were represented in much greater numbers than last year. Some colleagues also teamed up ahead of the race, training together as a running group. This made the event more than a sporting challenge. It was a chance to meet new colleagues, strengthen existing connections, and bring that sense of togetherness back to everyday work. Congratulations to all SUSS runners on their performance at B2Run Karlsruhe! And here’s to many more enjoyable sessions together – the running group was such a success that it’s set to continue. 👏 #SUSS #Semiconductor #GrowingInnovation #BreakingBarriersTogether 

Sustainability is becoming an increasingly important focus in semiconductor manufacturing, including wafer cleaning. From chemical use to emissions, the industry is challenged to combine high-performance processes with responsible resource management. What do you see as the biggest sustainability challenge in semiconductor manufacturing, especially wafer cleaning? We look forward to your answers. Feel free to explain your choice in the comments.

Not long ago, we introduced our new employer brand: 𝗕𝗿𝗲𝗮𝗸𝗶𝗻𝗴 𝗕𝗮𝗿𝗿𝗶𝗲𝗿𝘀. 𝗧𝗼𝗴𝗲𝘁𝗵𝗲𝗿. It is a milestone in our strategic Human Resources orientation. Stefanie Schuhmann, Vice President Global Human Resources, calls it “a key lever for attracting, developing, and retaining talent worldwide”. Our employer brand provides orientation, strengthens our culture, and makes it clear what we stand for as an employer. Stefanie adds: “Our goal is to create a consistent and authentic experience for existing and future employees across all regions. Translating our employer brand into everyday work is a crucial step in this process. I am proud of the work my team has done.” Franziska Vogel, Senior Manager Recruiting & Employer Branding, played a central role in bringing our employer brand to life. We discussed the topic in greater depth with her on our internal podcast, SUSS Unplugged. Would you like to take a look behind the scenes with us? We share some of the insights that Franziska provides. This is what Franziska says about… ➡️ how our corporate brand and our employer brand differ from one another: “Of course, the employer brand does not replace the corporate brand. It translates the overarching brand and its claim, Growing Innovation, into the culture we live and breathe and the way we work at SUSS. This gives our colleagues as well as future talent important guidance.” ➡️ what exactly the meaning of the slogan “Breaking Barriers. Together.” is: “On the one hand, it’s about technological hurdles that we need to overcome in order to develop ever new, innovative solutions for our customers. On the other hand, we have to accept that all companies face barriers that hinder effective collaboration. We want to send a clear signal here, make better use of synergies within SUSS, avoid duplication of work, and thus accelerate growth. This sense of clarity and focus on potential is really important to me because it will enable us to make SUSS even more successful.” ➡️ what talents are a good fit for SUSS: “People who use their skills and ideas to challenge the status quo and help innovations grow, regardless of their role.” ➡️ the vision for Recruiting and Employer Branding at SUSS: “It's all about the experience of applicants and employees, which we want to continuously improve. We want to roll out what we initially implemented in Germany worldwide to ensure strong, consistent messaging.” What are your experiences with strong employer brands and the impact they can have? Share your thoughts in the comments. #SUSS #Semiconductor #GrowingInnovation #BreakingBarriersTogether

A good start to the year 2026: In the first quarter, our order intake reached a record level. Versus the first quarter of 2025, it rose by 69.5% to €149.3 million. This development was driven by significantly higher demand from key customers for solutions used in the value chain for AI chip modules, as well as strong overall demand across all market segments of the semiconductor industry. It makes us confident for the whole year, as our CEO Burkhardt Frick states: “In the coming months, we expect the order situation to remain very positive, while at the same time temporarily increasing production capacity to operationally meet the high level of market demand.” Published today, our Q1 Interim Statement moreover reports: ➡️ Sales totaled €86.5 million, in line with expectations.  ➡️ Gross profit margin of 36.1% was within the full-year guidance corridor of 35% to 37%.  ➡️ EBIT margin reached 4.3%. For fiscal year 2026, our CFO Dr. Cornelia Ballwießer expects: “Based on what we know today, we believe we will achieve our full-year targets for 2026.” The guidance confirmed in the Interim Statement assumes sales in the range of €425 million to €485 million, a gross profit margin of 35% to 37%, and an EBIT margin of 8% to 10%. 🔔 Would you like to know how the financial year 2026 continues? Then mark your calendar for August 6, when we will publish our half-yearly financial report. Activate the bell on our SUSS profile to stay informed. #SUSS #Semiconductor #GrowingInnovation

𝗧𝘂𝗿𝗻𝗶𝗻𝗴 𝗶𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻 𝗶𝗻𝘁𝗼 𝗿𝗲𝗮𝗹𝗶𝘁𝘆 In our production, ideas become reality and technology turns into measurable success. With the highest precision, technical expertise, and reliability, our team works every day to realize innovative systems for the semiconductor industry. Join SUSS now and help us shape groundbreaking innovations together – within one of the most exciting industries of the future: the semiconductor industry. Find more details about the job as Group Lead Production (m/f/d) on our career site (link in comments). #BreakingBarriersTogether

Join us in May for a series of events focused on next-generation semiconductor technologies. You’ll find us at:  ➡️ Imaps Italy (We are represented by Electron mec)  ➡️ Semicon SEA  ➡️ ECTC In mid-May, we’re looking forward to another highlight: our SVP Advanced Backend Solutions, Dr. Robert Wanninger, will present at the ISIG Executive Summit in Taiwan: 🎤“Paving the way for next-generation HBMs: From low-TTV temporary bonding & debonding to face-to-back W2W hybrid bonding.” All event details are available in the PDF slider – just click through. Join the conversation and explore the technologies driving progress with us! #SUSS #Semiconductor #GrowingInnovation