长电科技

JCET Group Q1 2026 Financial Results are out! 🚀 We are thrilled to report a 42.7% YoY surge in net profit to approx. $42.4M, on revenue of $1.34B.* With the opening of our new Zhangjiang R&D Building in Shanghai and our continued expansion of high-end manufacturing capacity, we are accelerating our push into advanced packaging to support our global partners. 🔗 Read the full report here: https://lnkd.in/gjZFvX_K #JCET #Semiconductors #AdvancedPackaging #Q1Results #TechInnovation (Note: Financial figures converted from RMB to USD based on the latest exchange rate of approx. 1 USD = 6.838 CNY)

🌍 True ESG is driven by sustained commitment. This Earth Day, JCET marked our third consecutive year co-hosting the Yangtze River scientific fish release, safely returning over 35,000 native fish to the wild. Notably, the endangered Chinese sturgeons we released were implanted with microchips for precise scientific tracking and protection. As a global leader in semiconductor back-end manufacturing, this connection is incredibly meaningful to us—it highlights how the very technology our industry builds and packages serves as a crucial, tangible tool for environmental conservation. For JCET, ecological preservation is a long-term, institutionalized mechanism, not a standalone event. By championing science-driven biodiversity efforts year after year, we remain dedicated to proving that advanced technological manufacturing and nature conservation can seamlessly coexist, building a more sustainable future together. #JCET #ESG #Sustainability #Semiconductors #AdvancedPackaging #EarthDay #CorporateResponsibility

🚀 Breakthrough in RF Packaging for 5G & 6G! JCET has successfully validated our new wafer-level RF IPD process utilizing Glass-Based TGV and PSPI RDL technologies. Key highlights: ✅ Shifted to 3D inductors on glass substrates ✅ Boosted Q-factor by nearly 50% ✅ Outperforms traditional silicon-based IPDs This milestone paves the way for smaller, highly integrated RF front-ends and SiP solutions for the next generation of connectivity. Read the full press release: https://lnkd.in/g2ZFFPip #JCET #AdvancedPackaging #5G #6G #Semiconductor #TGV

Proud to be a Platinum Sponsor at SEMICON Southeast Asia 2026, May 5-7! We look forward to connecting with customers and partners across the ecosystem at Booth 2233. 🤝 #SEMICONSEA2026

JCET Group 2025 ESG Report is Live! 🌍 Chips power our intelligent world, and at JCET, we are committed to manufacturing them in ways that are intelligent, reliable, and responsible. Here is a quick look at our 2025 sustainability milestones: 🌱 Green Manufacturing: Achieved an 18% reduction in carbon emissions intensity (vs. 2022) and successfully expanded solar PV power across our global sites. 🤖 Smart Innovation: Our AI-enabled SDSS facility in Shanghai was officially recognized as a national Excellence-level Smart Factory. 💙 Community Impact: Drove long-term initiatives like protecting Yangtze River biodiversity and installing 180 solar streetlights for rural villages in Chongqing. 🤝 Industry Ecosystem: Hosted major advanced packaging conferences in Beijing and Singapore to accelerate joint innovation across the global value chain. 🔗 For more information, please visit: https://lnkd.in/gePCcfs4 #ESG #Sustainability #Semiconductor #JCET #SmartManufacturing #GreenEnergy #CorporateResponsibility

🚀 JCET Group achieves record-high revenue in our 2025 Annual Report! 📈 Despite a dynamic global market landscape, JCET continued to deliver steady growth, driven by our relentless focus on advanced packaging and continuous technological innovation. We are thrilled to share our outstanding 2025 results: 🔹 Record Full-Year Revenue: USD 5.44 billion (⬆️ 8.1% YoY) 🔹 Advanced Packaging Leadership: Revenue from advanced packaging hit a new high of USD 3.78 billion 🔹 Solid Profitability: Profit before tax (PBT) totaled USD 243.6 million (⬆️ 5.4% YoY) 🔹 Strong Segment Growth: Computing (+42.6%), Industrial & Medical (+40.6%), and Automotive (+31.7%) YoY 🔹 Innovation at the Core: R&D investment reached USD 292.6 million (⬆️ 21.4% YoY), driving systematic breakthroughs in high-density heterogeneous integration and advanced bonding. "In 2026, JCET will capitalize on growth opportunities in high-performance computing, storage, and embodied intelligence, speeding the translation of technology breakthroughs into mass-production capability," says CEO Mr. Li Zheng. Looking ahead, we remain deeply committed to powering the future of global tech through forward-looking investments and building a collaborative, open advanced packaging ecosystem. 💡🌍 🔗 Read our full FY2025 Report here: https://lnkd.in/eua_Xm6H #JCET #Semiconductors #AdvancedPackaging #TechInnovation #FinancialResults #HPC #AutomotiveElectronics #AnnualReport (Note: All financial figures are converted at an exchange rate of 1 USD = 7.144 RMB).

At SEMICON China 2026, JCET Group CEO Li Zheng shared that advanced packaging is entering an atomic-scale “precision revolution,” marking a structural shift for the semiconductor industry. As front-end scaling faces increasing physical and economic constraints, performance gains are moving beyond transistor shrink toward system-level integration, higher interconnect density, and improved overall energy efficiency. Technologies such as hybrid bonding are enabling breakthroughs in alignment accuracy, interface control, and ultra-dense chip-to-chip interconnects, effectively raising the ceiling of system performance. He also noted that rising process complexity is making AI tools increasingly essential in manufacturing, from digital twins and yield optimization to cross-disciplinary simulation. At the same time, advanced packaging innovations such as co-packaged optics are helping scale next-generation AI infrastructure. In the post-Moore era, atomic-level packaging is becoming a key pathway for sustaining semiconductor innovation and enabling system-driven performance growth. #SEMICONChina #AdvancedPackaging #HybridBonding #HeterogeneousIntegration #AI #JCET

🚀 JCET Group has officially commenced operations at its new Zhangjiang R&D Building in Shanghai. Designed as an integrated hub for R&D, pilot validation and collaboration, the facility features advanced laboratories, pilot lines, human‑centric workspaces and green building concepts—creating a strong foundation for innovation, talent development and cross‑team synergy. Anchored in the Zhangjiang Science City ecosystem, JCET will continue to accelerate advanced packaging and system integration technologies, turning innovation into real‑world impact. A new space. A new journey. Innovation starts here. #JCET #AdvancedPackaging #Semiconductors #Innovation #Zhangjiang #Shanghai

Great to see the global advanced packaging community come together at Advanced Packaging Developer Conference, this time with a strong focus on next-generation automotive and robotics semiconductor innovation. Held at our newly opened JCET Shanghai Automotive facility, the event gathered over 400 developers and technology leaders across the semiconductor ecosystem — from automotive OEMs and embodied AI robotics companies to IC design, wafer manufacturing, equipment, materials and testing partners. Discussions centered on how advanced packaging is enabling high-reliability system-level integration for increasingly complex computing, power and sensing architectures. Through keynotes and deep technical exchanges, the conference highlighted practical pathways to bridge innovation and manufacturability — accelerating collaboration across the value chain to bring scalable semiconductor solutions into real-world mobility and intelligent machine applications. #AdvancedPackaging #Semiconductors #AutomotiveElectronics #Robotics #APDC #JCET 

Today, JCET Group held the Grand Opening Ceremony of JCET Shanghai Automotive Co., Ltd. (JSAC). The new facility is dedicated to automotive-grade semiconductor packaging and testing, supporting applications including intelligent driving, vehicle control systems, and power & energy management. Designed to meet the stringent reliability requirements of the automotive industry, the site also supports emerging robotics and embodied AI applications, reflecting the growing convergence between intelligent vehicles and robotics systems. With highly automated production lines, full-process traceability, and AI-enabled quality monitoring, the facility further strengthens JCET’s capabilities in high-reliability semiconductor manufacturing for next-generation mobility and intelligent systems. #JCET #Semiconductors #AutomotiveElectronics #AdvancedPackaging #Robotics