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The 310x310 momentum continues.....thanks to the amazing team gathered #ECTC2026 in Orlando, Florida. Through presentation and papers, the message is strong: the shift to panel-level packaging addresses critical industry challenges, including rising interposer sizes and declining wafer-level efficiency. The larger panel format supports higher throughput and reduced cycle time, while enabling integration of increasingly complex multi-die architectures. These benefits are especially impactful for #AI data center and #HPC applications, where demand for larger package sizes and higher I/O density continues to accelerate. Thanks to CP Hung Teck Lee Lihong Cao Huang Dinos Sheng Li （李晟）Arthur Fan Wiwy Wudjud Bradford Factor #310x310 #panel

It’s an exciting day for ASE today as we announce the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing our leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer level packaging to panel level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to enter production in the first half of 2027. For more: https://lnkd.in/dz2rayUd “Panel-level packaging represents a pivotal step in enabling the next wave of AI-driven innovation,” said ASE EVP, Ingu Yin Chang while ASE's VP of Corporate R&D, Dr. CP Hung underscored, “This innovation enables higher integration density and supports the evolving requirements of AI and HPC systems, where performance, power efficiency, and manufacturability must be addressed holistically.” #310x310 #panel #VIPack #fanout #advancedpackaging #AI #HPM #datacenter #reticlesize #FOCoS #Bridge

We’re super excited to be collaborating with AMD to scale advanced packaging capabilities for AI infrastructure. Last week, AMD announced a major initiative to expand strategic partnerships with its key suppliers across the ecosystem in Taiwan, advancing leading-edge silicon, packaging and manufacturing technologies that enable higher performance, greater efficiency and faster deployment of AI systems. “Our collaboration with AMD on Elevated Fanout Bridge technology represents a significant step forward in scaling advanced packaging for high-volume applications,” said Steven Tsai, Senior Vice President, Sales, ASE. “By working together to industrialize EFB, we are enabling greater performance, efficiency and flexibility for next-generation data center platforms.” ASE Global | Siliconware Precision Industries Please click on the link for more information https://lnkd.in/dH6psgaY

🏎️ 𝗔𝗱𝘃𝗮𝗻𝗰𝗲𝗱 𝗣𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴 is the "𝗙𝗼𝗿𝗺𝘂𝗹𝗮 𝟭 𝗧𝗿𝗮𝗻𝘀𝗺𝗶𝘀𝘀𝗶𝗼𝗻" of the AI Era. A few weeks ago, we had the privilege of inviting Dr. Hamid Azimi Marvell Technology for a technology exchange with our team at ASE Kaohsiung. Dr Azimi is a recognized pioneer in semiconductor packaging for over 30 years and is now leading the development and deployment of next-generation packaging technologies and foundry strategies to support Marvell’s data infrastructure products. At the exchange session, the overarching core theme of Dr Azimi’s keynote presentation was that AI scaling is no longer just a silicon chip problem. It’s a systemic challenge driven by four crucial pillars: 𝗜𝗻𝘁𝗲𝗿𝗰𝗼𝗻𝗻𝗲𝗰𝘁, 𝗣𝗼𝘄𝗲𝗿, 𝗠𝗲𝗺𝗼𝗿𝘆, and 𝗧𝗵𝗲𝗿𝗺𝗮𝗹. In a brilliant analogy, he pointed out that while silicon remains the dominant "engine," 𝗮𝗱𝘃𝗮𝗻𝗰𝗲𝗱 𝗽𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴 𝗵𝗮𝘀 𝗯𝗲𝗰𝗼𝗺𝗲 𝘁𝗵𝗲 "𝘁𝗿𝗮𝗻𝘀𝗺𝗶𝘀𝘀𝗶𝗼𝗻 𝘀𝘆𝘀𝘁𝗲𝗺." Just like in an F1 car, the transmission determines how effectively that massive power gets transferred to the wheels. 𝗣𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴 𝗶𝘀 𝗻𝗼𝘄 𝘁𝗵𝗲 𝗿𝗲𝗮𝗹 𝗱𝗲𝗹𝘁𝗮 𝗱𝗲𝗳𝗶𝗻𝗶𝗻𝗴 𝗔𝗜 𝗽𝗲𝗿𝗳𝗼𝗿𝗺𝗮𝗻𝗰𝗲! We also had the opportunity to bring together both Marvell and ASE executives on stage for a panel discussion on breaking silos and the transition from linear supply chains to 𝗰𝗼𝗻𝗰𝘂𝗿𝗿𝗲𝗻𝘁, 𝘀𝘆𝘀𝘁𝗲𝗺-𝗹𝗲𝘃𝗲𝗹 𝗰𝗼-𝗱𝗲𝘀𝗶𝗴𝗻: 🎙️ Panel Highlights: • Haluk Balkan (VP, Marvell) & Nitin Deshpande (VP, Marvell) shared deep insights on driving the future of 𝗼𝗽𝘁𝗶𝗰𝗮𝗹 𝗶𝗻𝘁𝗲𝗿𝗰𝗼𝗻𝗻𝗲𝗰𝘁 and co-optimizing equipment, materials, and processes. • Representing ASE Global, EVP SF Wang and VP CP Hung discussed how OSAT’s role has fundamentally shifted from "passive chip protection" to "𝗮𝗰𝘁𝗶𝘃𝗲 𝗽𝗲𝗿𝗳𝗼𝗿𝗺𝗮𝗻𝗰𝗲 𝗲𝗻𝗮𝗯𝗹𝗲𝗺𝗲𝗻𝘁," highlighting the need for stable interposer solutions and platform integration. To scale the unscalable, 𝗻𝗼 𝘀𝗶𝗻𝗴𝗹𝗲 𝗰𝗼𝗺𝗽𝗮𝗻𝘆 𝗰𝗮𝗻 𝘄𝗶𝗻 𝗮𝗹𝗼𝗻𝗲. The future belongs to tight ecosystem partnerships, 𝗽𝗿𝗲𝗱𝗶𝗰𝘁𝗶𝘃𝗲 𝘀𝗰𝗮𝗹𝗶𝗻𝗴, and 𝗰𝗮𝗽𝗮𝗯𝗹𝗲 𝗰𝗮𝗽𝗮𝗰𝗶𝘁𝘆. Kudos to Dr. Azimi, Haluk, Nitin, and the ASE team for an incredibly inspiring session! #Marvell #ASEGlobal #ASETechTalks #AIScaling #AdvancedPackaging #Semiconductors #Innovation

Are you an extrovert or an introvert? At ASE, we’ve got something for both 😉 Whether you thrive in high-energy team sports or prefer a moment of zen, life at ASE is all about finding your rhythm. Looking back at a vibrant April, our clubs brought colleagues together across sites through a wide range of activities: 🚣♂️ 𝟭𝟬𝘁𝗵 𝗔𝗦𝗘 𝗗𝗿𝗮𝗴𝗼𝗻 𝗕𝗼𝗮𝘁 𝗖𝗵𝗮𝗺𝗽𝗶𝗼𝗻𝘀𝗵𝗶𝗽 Held in Kaohsiung, this milestone event brought together teams from 𝗖𝗵𝘂𝗻𝗴𝗹𝗶, SPIL 矽品, and Universal Scientific Industrial Co., Ltd.. A decade in, the race continues to showcase not just speed—but the power of teamwork, tradition, and cross-site connection. 🏀 𝗕𝗮𝘀𝗸𝗲𝘁𝗯𝗮𝗹𝗹 𝗙𝗿𝗶𝗲𝗻𝗱𝗹𝘆 𝗠𝗮𝘁𝗰𝗵 An exciting showdown with our Chungli teammates, where every pass and play reflected strong chemistry and team spirit. 📸𝗣𝗵𝗼𝘁𝗼𝗴𝗿𝗮𝗽𝗵𝘆 𝗖𝗹𝘂𝗯 Seeing the world through a different lens. Our members practiced capturing light and shadow, turning everyday moments into extraordinary "New Visions." 🪴𝗣𝗹𝗮𝗻𝘁 𝗖𝗹𝘂𝗯: "𝗚𝗿𝗲𝗲𝗻 𝗟𝗶𝗳𝗲" 𝗘𝘅𝗵𝗶𝗯𝗶𝘁𝗶𝗼𝗻 Step into a space of calm. This exhibition invited colleagues to take a break from busy schedules, reconnect with nature, and experience the quiet healing power of greenery. 👨👩👧👦 𝗙𝗮𝗺𝗶𝗹𝘆 𝗦𝗽𝗼𝗿𝘁𝘀 𝗗𝗮𝘆: “𝗪𝗶𝘇𝗮𝗿𝗱 𝗼𝗳 𝗢𝘇 𝗔𝗱𝘃𝗲𝗻𝘁𝘂𝗿𝗲” A vibrant collaboration between our Parent-Child Learning, Jogging, and Environmental Education Volunteer clubs. It was a day of laughter, bonding, and sustainable fun for the whole family. At ASE, we celebrate diversity not just in innovation—but in how we live, connect, and recharge. No matter your personality, there’s a place for you here. 𝗪𝗵𝗶𝗰𝗵 𝘃𝗶𝗯𝗲 𝗿𝗲𝘀𝗼𝗻𝗮𝘁𝗲𝘀 𝘄𝗶𝘁𝗵 𝘆𝗼𝘂 𝗺𝗼𝗿𝗲 𝘁𝗼𝗱𝗮𝘆? 𝗧𝗲𝗮𝗺 "𝗘" ⚡️ 𝗼𝗿 𝗧𝗲𝗮𝗺 "𝗜" 🌿? 𝗟𝗲𝘁 𝘂𝘀 𝗸𝗻𝗼𝘄 𝗶𝗻 𝘁𝗵𝗲 𝗰𝗼𝗺𝗺𝗲𝗻𝘁𝘀 𝗯𝗲𝗹𝗼𝘄! #ASEGlobal #LifeAtASE #WorkLifeBalance #EmployeeEngagement

#SEMICONSEA 2026 wrapped up on a high note after an exciting three days in Kuala Lumpur, Malaysia!  🇲🇾   Last week, ASE Global was proud to connect with customers, partners, industry professionals, and future talents at our booth, where visitors experienced our latest innovations and interactive showcases firsthand.   At the ASE booth, visitors explored: ✨ Advanced packaging technologies and solutions powering the future of #AI and high-performance computing 🏭 An immersive VR #SmartFactory experience showcasing ASE’s smart manufacturing capabilities 👥 Career opportunities and networking sessions with our onsite HR recruitment team 🎁 Fun engagement activities and lucky draws featuring our limited-edition ASE swag   We were also honored to welcome Datuk Seri Johari Abdul Ghani, Minister of Ministry of Investment, Trade and Industry (MITI) and YB Tze Tzin Sim, Deputy Minister of #MITI during the VIP booth tour, where discussions centered around advanced packaging, AI, heterogeneous integration, and smart manufacturing.   A huge thank you to everyone who stopped by our booth, participated in our activities, and connected with the ASE team throughout the week. We truly appreciate the support and look forward to seeing you again at the next #SEMICONSEA! 👋 #SEMICONSEA2026 #ASE #AdvancedPackaging #SmartManufacturing #AI #HPC #Semiconductor #LifeAtASE #LifeatASEMalaysia

SEMICON SouthEast Asia remains one of the most anticipated events on ASE's annual calendar, and this year's edition stood out for both its scale and the depth of its conference programming. AI was the defining thread throughout, and no session captured that more sharply than the Executive Leadership Summit on Day One, where speakers brought rare clarity to the conversation: not just what AI can achieve, but what industries and organizations must truly understand to deploy it with purpose. Among the keynote standouts, onsemi CPO Nana Tseng delivered the summit's most operationally grounded perspective. She reframed supply chain and sourcing as strategic levers in a fragmented global environment, making the case that regionalization is no longer a contingency, it's an operating reality. While resilience remains essential, Nana's central argument was that agility, such as balancing risk, execution speed, and time-to-market, is what separates first movers from the rest and ultimately protects margins. Her ability to cut through rhetoric and name what companies are quietly confronting was what made her keynote resonate: in an AI-driven economy, supply chain agility is becoming as critical as innovation itself. ASE's own Jihan Chen carried the #AI thread forward with a technically compelling look at Co-packaged Optics (CPO), and why advanced packaging is fast becoming foundational to AI infrastructure. It was standing room only! With AI workloads demanding exponentially more bandwidth and efficiency, CPO delivers by integrating optical and electrical components within a single package, scaling from 1.6Tbps to beyond 32Tbps while cutting energy consumption. Jihan closed with a showcase of ASE's full turnkey CPO capabilities, from 3D integration to Known Good Optical Engine (KGOE) validated solutions, cementing ASE's role at the frontier of next-generation AI hardware. #semiconductor #leadership #advancedpackaging #VIPack #datacenter #CPO #siliconphotonics #energyefficiency

Since March, 𝗔𝗦𝗘 𝗵𝗮𝘀 𝗿𝗲𝗮𝗰𝗵𝗲𝗱 𝗮𝗻 𝗶𝗻𝗰𝗿𝗲𝗱𝗶𝗯𝗹𝗲 𝗺𝗶𝗹𝗲𝘀𝘁𝗼𝗻𝗲: 𝗯𝗿𝗲𝗮𝗸𝗶𝗻𝗴 𝗴𝗿𝗼𝘂𝗻𝗱 𝗼𝗻 𝗮 𝗻𝗲𝘄 𝗳𝗮𝗰𝗶𝗹𝗶𝘁𝘆 𝗲𝘃𝗲𝗿𝘆 𝘀𝗶𝗻𝗴𝗹𝗲 𝗺𝗼𝗻𝘁𝗵. Today, we keep that momentum going in Kaohsiung! We are establishing an advanced packaging hub in collaboration with WUS printer circuit. This investment is a 𝘀𝗶𝗴𝗻𝗶𝗳𝗶𝗰𝗮𝗻𝘁 𝘀𝘁𝗲𝗽 𝘁𝗼𝘄𝗮𝗿𝗱 𝘀𝘂𝗽𝗽𝗼𝗿𝘁𝗶𝗻𝗴 𝘁𝗵𝗲 𝗴𝗹𝗼𝗯𝗮𝗹 #AI 𝗮𝗻𝗱 #HPC 𝗲𝗰𝗼𝘀𝘆𝘀𝘁𝗲𝗺, ensuring we stay ahead of increasing market demands. 𝗣𝗿𝗼𝗷𝗲𝗰𝘁 𝗵𝗶𝗴𝗵𝗹𝗶𝗴𝗵𝘁𝘀 🔹𝗔𝗱𝘃𝗮𝗻𝗰𝗲𝗱 𝗣𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴: Specializing in FOCoS and FC BGA technologies to power the next generation of AI and cloud applications. 🔹𝗦𝗺𝗮𝗿𝘁 𝗮𝗻𝗱 𝗚𝗿𝗲𝗲𝗻 𝗠𝗮𝗻𝘂𝗳𝗮𝗰𝘁𝘂𝗿��𝗻𝗴: Integrating automated processes with EEWH Gold-standard green building design to maximize efficiency while advancing our sustainability goals. 🔹𝗘𝗻𝗲𝗿𝗴𝘆 𝗥𝗲𝘀𝗶𝗹𝗶𝗲𝗻𝗰𝗲: Featuring the Nanzih Technology Industrial Park's first 161kV substation to ensure stable, high-quality power for our advanced production lines. "Through this collaboration, we are expanding our capacities to meet market demands and establishing 𝗮 𝗻𝗲𝘄 𝗯𝗲𝗻𝗰𝗵𝗺𝗮𝗿𝗸 𝗳𝗼𝗿 𝗶𝗻𝗱𝘂𝘀𝘁𝗿𝗶𝗮𝗹 𝗱𝗲𝘃𝗲𝗹𝗼𝗽𝗺𝗲𝗻𝘁," says Mike Hung, EVP of ASE. Read the full press release here → https://lnkd.in/gnziyYDZ •┈┈┈┈┈┈୨୧┈┈┈┈┈┈• 自三月以來，日月光寫下了每個月都有新廠動土的里程碑。 我們很高興宣布：日月光與 #楠梓電子 正式攜手，啟動位於高雄楠梓產業園區的先進廠房合建計畫🤝，聚焦扇出型封裝 FoCoS 與覆晶封裝 FC BGA 等#先進封裝 技術，因應AI、高速運算（HPC）、雲端服務與自動駕駛等高階應用需求。 本投資案預計於2029年9月正式啟用，並創造超過2,000個就業機會，持續帶動地方產業與經濟發展。 詳細內容請見官網→https://lnkd.in/gyysJGb7 #ASEGlobal #BreakingGround #Semiconductor #AdvancedPackaging

🎶 Oh what a night 🎵 It is such a great experience to be at #SEMICON SEA 2026 and even more gratifying to witness the recognition of leaders that we deeply admire and respect. At the gala dinner wrapping up day 1, SEMI SEA honored 3 remarkable individuals who have not only contributed professionally, but have each made an indelible mark on the semiconductor industry. 🏆 Congratulations Dato’ Loo Lee Lian of InvestPenang on receiving SEMI’s Honorary Award. Her name is synonymous with Penang State, and she wears that identity with pride. A true Penangite at heart, her passion for promoting investments in Penang is boundless and infectious. She has also been an unwavering supporter and collaborator of SEMI SEA, and the ecosystem is stronger for it. ⚡Distinguished Board Service award. Andrew Goh ’s energy is simply remarkable. Beyond his role at Lam Research , Andrew consistently goes above and beyond to advance SEMI’s mission through thought leadership, policy engagements, workforce development, and a tireless commitment to building connections across the industry. While he has decided to step back from his current capacity, we know this isn’t goodbye as contributing to this industry is simply in his DNA. 🌟 Team SEMI SEA penned a very touching tribute to Bettina Weiss of SEMI International. Few people have played as quietly pivotal a role as she has - providing critical support to global teams, and to SEA in particular, across countless initiatives over the years. Over the past 3 decades she has been a true pillar of strength, and much of what SEMI SEA has achieved today stands on the foundation she helped build. It is truly deserving that Bettina is honored with the Lifetime Achievement Award. All of us at ASE especially Patricia MacLeod and Jennifer Yuen, wishes her all the best as she embarks on an exciting new chapter. To Dato’ Loo, Andrew, and Bettina: thank you for your generosity, your passion, and your extraordinary contributions. You have each left a legacy that will continue to inspire. #SEMICONSEA #SemiconductorIndustry #SEMI #SEA #Leadership

𝗛𝗮𝗽𝗽𝘆 𝗟𝗮𝗯𝗼𝗿 𝗗𝗮𝘆! 💐  “Innovation” is a word we use often—but behind it are people who bring 𝗱𝗲𝗱𝗶𝗰𝗮𝘁𝗶𝗼𝗻, 𝗰𝗿𝗲𝗮𝘁𝗶𝘃𝗶𝘁𝘆, and 𝗽𝘂𝗿𝗽𝗼𝘀𝗲 to everything they do. From the factory floor to global collaboration across teams, it’s this collective effort that continues to push boundaries and turn ideas into impact. 𝗧𝗼𝗱𝗮𝘆, 𝘄𝗲 𝗰𝗲𝗹𝗲𝗯𝗿𝗮𝘁𝗲 𝘁𝗵𝗲 𝗽𝗲𝗼𝗽𝗹𝗲 𝘄𝗵𝗼 𝗺𝗮𝗸𝗲 𝗶𝘁 𝗮𝗹𝗹 𝗽𝗼𝘀𝘀𝗶𝗯𝗹𝗲. 感謝所有夥伴的辛勤付出，祝大家有個愉快的勞動節假期！ 放下忙碌，好好享受屬於您的休息時光。✨ #ASEGlobal #LaborDay #PeopleBehindInnovation #TeamASE #勞動節快樂