The Storage Networking Industry Association (SNIA) has launched the Storage.AI initiative, an open standards project in collaboration with leading tech companies including AMD, Intel, and Samsung. The initiative aims to optimize end-to-end data flow for AI workloads by defining universal interfaces such as the memory-semantic SDXI, enabling seamless coordination across GPUs, SSDs, and network infrastructure. By breaking down "data silos," Storage.AI seeks to reduce GPU idle time by 30-50%, significantly improve computational efficiency in AI training and inference, lower integration complexity, and establish a vendor-neutral ecosystem for scalable and cost-effective AI infrastructure.
SNIA launches Storage.AI initiative with AMD, Intel, Samsung
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AMD Instinct and DriveNets Ethernet Fabric https://lnkd.in/dKjVqVZR AI innovation depends not just on raw GPU power, but on the fabric that ties GPUs together. The DriveNets Network Cloud-AI networking fabric solution delivers the highest performance AI connectivity for any GPU, NIC or optics, based on lossless, Ethernet-based backend fabric. In this post, Sani Ronen explains how the DriveNets solution enables the industry’s fastest time-to-first-token (TTFT) and lowest cost per million tokens for AI clusters based on AMD Instinct GPUs.
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Is the "chip war" a misnomer? By 2025, the real battle is the "packaging war." We're all focused on GPU design, but what if NVIDIA's real uncopyable moat isn't the logic chip, but the advanced package it sits on? The "monolithic" chip is dead. The future is "chiplets." And the value has shifted from designing the chip to connecting them at scale. Technologies like TSMC's CoWoS are the new strategic high ground. Is your supply chain strategy still focused on the wrong war? 👉 Full analysis of this architectural shift: https://lnkd.in/g8q3HmzE #AdvancedPackaging #Chiplets #AIChips #Semiconductors #NVIDIA #TSMC #CoWoS #Strategy
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Nvidia Reports Strong Demand for Blackwell AI Chips Amid TSMC Expansion📈 NVIDIA CEO Jensen Huang stated on November 8, 2025, at TSMC's annual sports day in Hsinchu, Taiwan, that the company is seeing very strong demand for its Blackwell AI chips, with production scaling through increased wafer support from #TSMC. - Huang noted the business is growing month by month, with Blackwell encompassing GPUs, CPUs, networking components, and switches. - TSMC CEO C.C. Wei confirmed Nvidia requested additional wafers, though quantities were not specified. - This marks Huang's fourth public visit to Taiwan this year. TSMC praised Nvidia's role in reaching a $5 trillion market value in October. - Huang added there are no active discussions about selling Blackwell chips to China. #Nvidia #Blackwell #TSMC #AI #Semiconductors #TechNews #Innovation
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💡 What exactly is an AI PC, and why is it better? In this 2-minute video, Dennis Luo from Intel Corporation breaks it down with CyberLink’s Creative Director, David Morgan. One of the biggest advantages? Power savings.⚡ By shifting AI workloads to the NPU (Neural Processing Unit), AI PCs run more efficiently, extending battery life and reducing strain on the CPU and GPU, all while keeping performance high. Watch now to see why AI PCs are redefining the future of personal computing. #AIPC #Intel #CyberLink #Innovation
What is an AI PC and Why is it Better?
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ASUS Unveils XA NB3I-E12 AI Server Powered by NVIDIA HGX B300 Platform ASUS announced the shipment of the XA NB3I-E12 AI server, built on the NVIDIA HGX B300 platform. Delivering next-generation AI performance and reliability, XA NB3I-E12 gives enterprises and cloud-service providers (CSPs) early access to cutting-edge computing capabilities for the AI era. Accelerated by eight NVIDIA Blackwell Ultra GPUs and dual Intel® Xeon® 6 Scalable processors, ASUS XA NB3I-E12 is engineered for intensive AI workloads. With eight NVIDIA ConnectX-8 InfiniBand SuperNICs , five PCIe® expansion slots, 32 DIMMs, 10 NVMe drives, and dual 10Gb LAN, it transforms data into intelligence for real-world automation. The system is ideal for enterprises and CSPs running large language models (LLMs), research institutions and universities performing scientific computing, and the financial and automotive sectors focused on AI model training and inference. Read More: https://lnkd.in/gfh_rFP8 #ASUS #server #NVIDIA #HGXB300 #CSP #AI #DigitalTerminal ASUS Dinesh Sharma Vaibhav Kulkarni
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Qualcomm is intensifying its challenge to NVIDIA and AMD in the AI chip space by developing LPDDR-based AI processors aimed at AI PCs, leveraging its Snapdragon X Elite platform with 45 TOPS NPU performance. While these chips promise strong energy efficiency and competitive AI capabilities, concerns remain over their thermal durability and long-term reliability under sustained workloads. As Qualcomm pushes ARM-based solutions into a market dominated by x86 giants, the success of its AI ambitions may hinge on overcoming these engineering hurdles. #Qualcomm #ChipMaker #Chips #AIChips #SnapdragonXElite #Semiconductors #SemiconductorIndustry #LPDDR #AIComputing #Tech #Innovation #ARMvsX86 #ThermalEngineering #AIHardware #TechnologyNews https://lnkd.in/dSzRz9ZW
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Liquid-cooled. Scalable. Engineered for the AI Era. Powered by Lenovo and NVIDIA, the NVIDIA GB300 NVL72 offers liquid-cooled performance at all levels—cluster, rack, and node. With up to 576 NVIDIA Blackwell Ultra GPUs, this scalable system is designed for rapid training and inference. Learn more: http://spr.ly/60407DyIp | #WeAreLenovo #LenovoCSP #OCP2025
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