Sima Noghanian

SwRI’s new spherical near-field antenna test chamber accurately samples the near field of an antenna, which engineers can then mathematically transform into far-field data. Analyzing both fields provides more complete performance evaluations. #TechTuesday https://ow.ly/bZX050YR66s

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Yesterday at the PECC Summit in Sunnyvale, CA, our CCO Gunnar Stolze shared a powerful message: “InP photonic integration eliminates dozens of fiber interfaces—shrinking footprint, reducing cost, and improving reliability in data-center optics.” A great example of how innovation and technology come together to build the infrastructure of tomorrow. Proud to witness this live at the Juniper Networks Aspiration Dome, made possible by Optica and the Advanced Photonics Coalition #technology #innovation #integratedphotonics #future #datacenter #fiberoptics #artificialintelligence

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“InP photonic integration eliminates dozens of fiber interfaces—shrinking footprint, reducing cost, and improving reliability in data-center optics.” Gunnar Stolze, SMART Photonics today at the PECC Summit today in Sunnyvale, Ca at the Juniper Networks Aspiration Dome produced by Optica + Advanced Photonics Coalition #technology #innovation #future #datacenter #liveevent #futurism #fiberoptics #artificialintelligence #digitalmarketing #management

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Apple's intiatives for workforce development in system-on-chip design. A great example for a system company in developing the needed engineering talent in chip design to empower innovative system products. A presentation at the ISSCC 2026 https://lnkd.in/g7pjGMHr

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Spectrum Control, an innovative leader in RF miniaturization and digital integration, introduced its expanded RF + Systems-in-Package (SiP) platform at IEEE MTT-S International Microwave Symposium (IMS) 2025 in San Francisco last week. The new SiP product platform is comprised of integrated, surface-mount system blocks that offer significant reductions in cost, engineering/development time, and size without limiting performance. Continue to read - https://ow.ly/gZL250WeBtB #IMS #IMS2025 #rf #SiP #technology

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✨Editor's Choice Article✨ Liu, C.; Liao, C.; Peng, Y.; Zhang, W.; Wu, B.; Yang, P. Microwave Sensors and Their Applications in Permittivity Measurement. Sensors2024, 24, 7696. 🏫Sichuan University, Yibin Industrial Technology Research Institute of Sichuan University, Sichuan Yibin Plastic Packaging Materials Co., Ltd. This paper reviews microwave sensors and their applications in permittivity measurement. The detection, diagnosis, classification, and monitoring without contact and invasion have been the subject of numerous studies based on permittivity characteristics tracking. This review illustrates many new types of research in recent years. Firstly, the application background is briefly introduced, and several main measurement methods are presented. An overview of measurement technology in various applications is compiled and summarized based on numerous typical examples. Exciting applications are compared and presented separately, combining resonator sensors with strong electric fields. Furthermore, differential signals represent trends for future applications with strong environmental immunity, an alternative option to expensive measuring equipment. With the alternation of metamaterials, microfluidics technologies, cross-technology, algorithms, and so on, sensors play an exceptionally prominent role in practical and low-cost applications. https://lnkd.in/eCYus5w2

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💡Article spotlight: Integrated RF Energy Harvesting and Power Conversion Circuits: A Review and Roadmap for Wireless-Powered System-on-Chip (SoCs) This paper reviews the state-of-the-art in CMOS rectifier design and goes on to discuss paths toward more integrated system-on-a-chip technologies and approaches. The field of RF energy harvesting, and especially the advances in wireless power transfer devices, has been growing at an exponential rate as the Internet of Things keeps expanding its reach and demanding more and more energy usage. This is a great article for those interested in getting up to speed in this rapidly evolving area of EE devices and circuits. This paper is from our November 2025 issue. 📎 Read the full article here: https://lnkd.in/gM-aNhmX  🌐 Topics covered in this article: RF energy harvesting, rectenna, rectifier, CMOS, microwave power transmission, RFID 📝 Authors: Sitong Mu, Mahmoud Wagih

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Lumentum's latest episode of #AskTheExpert answers a timely question: why has #Lumentum selected MEMS for their optical switching technologies for #AI infrastructure applications? 🎥 Tune in for episode 3 with Peter Roorda, General Manager of Switching, to discover how field-proven reliability and optical performance set our MEMS-based technology apart. 🔗 Catch up on previous episodes on our website: https://bit.ly/47pOHbZ

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Publication: Open Journal of the Solid-State Circuits Society Article: Recent Advances of High-Speed Short-Reach Optical Interconnects for Data Centers Authors: Chongyun Zhang; Fuzhan Chen; Li Wang; Lin Wang; C. Patrick Yue Editor's Comments: Covering recent design challenges and advances of optical transceivers, PLLs, and CDRs for ~100m-distance data center applications Read here: https://bit.ly/45mKIwS #ArticleSpotlight #SSCL #EditorsPick #SSCS #IEEE

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𝗣𝗔𝗨𝗧 𝗶𝘀 𝗻𝗼𝘁 𝗮𝗹𝘄𝗮𝘆𝘀 𝗮𝗯𝗼𝘂𝘁 𝗶𝗺𝗮𝗴𝗶𝗻𝗴, 𝘀𝗼𝗺𝗲𝘁𝗶𝗺𝗲𝘀 𝗶𝘁’𝘀 𝗮𝗯𝗼𝘂𝘁 𝗽𝗮𝘁𝘁𝗲𝗿𝗻𝘀 In long, threaded components, expecting a clean ultrasonic image is often unrealistic. But that doesn’t mean PAUT has no value. In a conventional A-scan, reflections from threads, mode conversions, and head waves quickly merge into an unreadable signal. In a sectorial scan, however, something else appears: 𝗮 𝗽𝗮𝘁𝘁𝗲𝗿𝗻. Threads generate a repetitive reflection signature. Fatigue cracks break that symmetry. PAUT becomes less a localization tool and more a comparison tool: 🔹good bolt vs suspect bolt 🔹baseline vs anomaly The value comes from recognizing differences, not from resolving fine geometry. This shift in mindset is critical when inspecting complex or extreme geometries. 𝗛𝗮𝘃𝗲 𝘆𝗼𝘂 𝗲𝘃𝗲𝗿 𝗿𝗲𝗹𝗶𝗲𝗱 𝗼𝗻 𝗣𝗔𝗨𝗧 𝗺𝗼𝗿𝗲 𝗳𝗼𝗿 𝗰𝗼𝗺𝗽𝗮𝗿𝗶𝘀𝗼𝗻 𝘁𝗵𝗮𝗻 𝗳𝗼𝗿 𝗽𝗿𝗲𝗰𝗶𝘀𝗲 𝗹𝗼𝗰𝗮𝗹𝗶𝘇𝗮𝘁𝗶𝗼𝗻? #PAUT #NDT #PhasedArray #UltrasonicTesting #InspectionLife

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This paper explores #cumulative #distribution #function (#CDF)-based user scheduling scheme for a dual-hop multi-user RF and #hybrid #FSO/ #RF decode and forward (DF) relaying system under independent and non-identically distributed (i.n.i.d) #co-#channel #interference (#CCI), ensuring precise temporal fairness among users. The RF links are modeled using Nakagami-m fading, whereas the FSO link is characterized by a Fisher-Snedecor F distribution with boresight pointing errors. At the destination, selection combining is employed, and a closed-form expression for the #outage #probability (#OP) is derived. To further analyze the system behavior, an asymptotic OP is evaluated, providing insights into the diversity order. To improve the system performance, expressions for power allocation and #channel #access #ratio (#CAR) optimization are obtained using the asymptotic expression. ---- Rekha Rani, N. Jayanthi, Anup Mandpura More details can be found at this link: https://lnkd.in/euttRXPr

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Y. Wang, Q. Xue, H. Xie, Y. Wan, and X. Liu present a modal-driven decoupling and modal-mapping beamforming method for wideband dual-polarized multiport antennas. Read it at: https://lnkd.in/dUahvY9R #ieee #ieeetap #ieeeaps #decoupling #modal-mapping #beamforming #wideband #dual-pol #antenna

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Dr. Ehsan Azad from Compound Semiconductor Applications (CSA) Catapult presented a forward-looking perspective on optimizing energy efficiency in cellular networks through advanced power amplifier (PA) technologies. As mobile networks evolve toward 5G and 6G, the role of PAs becomes increasingly central. The PAs need to handle higher frequencies, greater data loads, and more complex signal structures, all while minimizing energy consumption. With innovations like Doherty, LMBA, and envelope tracking, and the adoption of GaN-on-SiC compound semiconductor materials, next-generation PAs are enabling more efficient, high-performance base stations. These improvements not only support sustainable network growth but also reduce operational costs and carbon footprint. The collaboration between industry leaders, research institutions, and standardization bodies is accelerating progress, with continuous breakthroughs in RF efficiency and system-level integration happening now. The RF power amplifier market is set to expand by 250% by 2032, powering the future of universal, energy-conscious connectivity. 📱 CSA Catapult is developing advanced RF power amplifier technologies and enhancing energy efficiency in radio units, to lower operational costs and provide globally competitive mobile services https://lnkd.in/erbdxq6b Read more ➡️ Providing the UK with a resilient, secure and energy-efficient future telecoms network: https://lnkd.in/eF473JWd For Dr. Ehsan's full video presentation, click comment box! click #subscribe #youtube 1k plus 5G and #5GAdvanced #usecases #presentation available here! click https://lnkd.in/gnP__FMq 𝗦𝘂𝗽𝗽𝗼𝗿𝘁 𝘁𝗵𝗲 𝗚𝗹𝗼𝗯𝗮𝗹 𝟱𝗚 𝗘𝘃𝗼𝗹𝘂𝘁𝗶𝗼𝗻 𝗰𝗼𝗺𝗺𝘂𝗻𝗶𝘁𝘆! Your donation helps us continue delivering the latest insights, research, and conference discussions about the global 5G revolution. Every contribution enables us to sustain and grow this platform for the benefit of all members. Thank you for your support! 𝗖𝗵𝗼𝗼𝘀𝗲 𝘆𝗼𝘂𝗿 𝘄𝗮𝘆 𝘁𝗼 𝘀𝘂𝗽𝗽𝗼𝗿𝘁: Small monthly recurring donation: https://lnkd.in/e4MAD7pN One-time donation: https://lnkd.in/eitCeewX

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The February 2026 IEEE issue of IEEE Microwave Magazine is out!  In this month's issue, you can read about the real breadth of the work by MTT's members. In this focus issue, you will find four technical features that cover the microwave 'spectrum' in pre- and post-distortion techniques, CMOS LNAs, computational optimization of microwave circuits and a tutorial on backscattered signals. In addition to the technical features, we have our regular columns such as the President's Message, MicroBusiness, and a focus on the work done by the MTT's Autonomous and Connected Systems technical committee. It is a packed issue, and so check out your copy today! https://lnkd.in/eGY-dsq #MicrowaveTechnology #Innovation #MicrowaveMagazine #IEEEMicrowaveMagazine #MicrowaveEngineering #FebruaryIssue #MHztoTHzCommunity #MicrowaveInnovations #Innovations #BreadthofMTT

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Today’s featured paper in our issue 📗 presents "Self-Equalized Generalized Chebyshev Microwave Filters in Inline Topology Using Double-Zero Single-Pole Frequency-Variant Coupling Networks." 𝗗𝗲𝘃𝗶𝗰𝗲: Self-equalized generalized Chebyshev microwave bandpass filters (BPFs) in inline coupled-resonator circuit topologies. 𝗦𝗽𝗲𝗰𝘁𝗿𝘂𝗺: 1.5 GHZ and 9.98 GHz for the examples presented 𝗡𝗼𝘃𝗲𝗹𝘁𝘆: Chebyshev microwave bandpass filters (BPFs) can be realized as frequency-variant reactive coupling (FVRC) networks with double-zero single-pole (DZSP) characteristics. With zeros positioned on the imaginary axis for selectivity enhancement or as a pair of real zeros for in-band group delay equalization, microwave BPFs with in-band equi-ripple-type response and close-to-passband transmission zeros (TZs) can be designed entirely with inline topologies – i.e., without cross-coupling. 𝗣𝗲𝗿𝗳𝗼𝗿𝗺𝗮𝗻𝗰𝗲: Self-equalized 5th-order BPF with 2 imaginary TZs and 2 complex zeros – at 1.5 GHz (microstrip circuit), realized with 4 resonators, 3 frequency-variant couplings, 2 constant couplings, and 0 cross couplings; at 9.98 GHz (waveguide structure), realized with 3 resonators, 2 frequency-variant couplings, 2 constant couplings, and 0 cross couplings. 𝗔𝗽𝗽𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻: Self-equalized Chebyshev microwave bandpass filters (BPFs) with flattened group delay, sharp rejection, in-band equi-ripple-type response and close-to-passband transmission zeros (TZs). 𝗥𝗲𝗮𝗱 𝗺𝗼𝗿𝗲 𝗵𝗲𝗿𝗲: https://lnkd.in/dgK9avVa #ieee #ieeetmtt #ieeemtt #mtt #tmtt #featuredpaper #microwaves #RF #Bandpass #filter #BPF #DZSP #frequencyvariant #reactive #coupling #FVRC #FDC #FVC #Chebyshev #microstrip #planar #waveguide

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Blog: "Why Electrical Design Matters in #Chiplet Architectures – Part One: Signal Integrity and Power Delivery" By Mayank Bhatnagar (Cadence), Soheil Modirzadeh (Synopsys Inc) and Sajani Patel (Synopsys Inc) https://lnkd.in/eqfybuhD In this first installment of a two-part series on electrical design in #chiplet architectures, the authors focus on three foundational pillars: signal integrity, high-speed data transfer, and power delivery. These are the bedrock issues that determine whether chiplets can communicate effectively, maintain performance under load, and deliver on the power efficiency and latency gains that drove their adoption in the first place. Learn more at https://lnkd.in/eqfybuhD #chiplet #3DIC #AdvancedPackaging #MultiDie #semiconductor

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