QP Technologies

LIVE at ECTC 2026! Stop by Booth 116 to connect with Ashley Knowles, Mike Strittmatter, and Louie Mosqueda to learn more about our advanced microelectronics packaging, assembly, and manufacturing solutions for high-reliability applications. We’ll be here today until 6:30 PM and tomorrow from 9:00 AM – 4:00 PM. We look forward to seeing you there! #ECTC2026 #Microelectronics #Semiconductor #AdvancedPackaging #ElectronicsManufacturing #QPTechnologies #Promex

Join QP Technologies and Promex at Booth 24072 as we showcase advanced RF and microwave packaging solutions designed to support next-generation high-performance applications. 📍 IMS 2026 📅 June 9–11, 2026 (exhibition days) 📌 Boston, MA From complex semiconductor packaging to high-reliability microelectronics manufacturing, our team is looking forward to connecting with industry leaders, partners, and innovators throughout the week. If you’ll be attending, stop by and see how we’re helping drive the future of advanced electronics. #IMS2026 #Semiconductor #Microelectronics #RF #Microwave #AdvancedPackaging #ElectronicsManufacturing #QPTechnologies #Promex

Modern microchips are pushing the limits of what’s physically possible. Today’s semiconductor features are so small that thousands of transistors can fit across the width of a single human hair. At that scale, the difference between success and failure comes down to precision at the micron and nanometer level, where packaging, assembly, and interconnect integrity are just as critical as the silicon itself. At QP Technologies, this is exactly where advanced packaging and assembly play a key role. As devices continue to shrink and performance demands increase, enabling reliable interconnects and high-density integration is essential for next-generation aerospace, defense, medical, and high-performance applications. The future of computing isn’t just about making chips smaller, it’s about making them work together flawlessly at extreme scale. #Semiconductors #Microchips #AdvancedPackaging #SemiconductorPackaging #Interconnects #QPTechnologies

What does power look like up close? Like this. ⬇️ Those golden threads aren't decoration, they're the lifelines of a power semiconductor package. Each wire bond carries electrical current and thermal energy away from the die, keeping devices running reliably under some of the most demanding conditions imaginable. At QP Technologies, wire bonding is more than a process — it's a craft. The placement, the loop geometry, the bond consistency across dozens of connections — it all matters when the application demands it. Power modules for EVs. Industrial drives. Aerospace systems. The technology enabling them starts here, at the bond wire level. We love what we do. And it shows. Curious about our wire bonding capabilities for power applications? Let's connect. https://lnkd.in/egRX8D3J #WireBonding #PowerSemiconductors #Microelectronics #QPTechnologies #ElectricVehicles #AdvancedPackaging #Precision

Join QP Technologies and Promex at the 2026 Electronic Components and Technology Conference (ECTC), taking place May 27–28 in Orlando, Florida. Visit us at Booth #116 to explore our advanced microelectronics packaging, assembly, and heterogeneous integration capabilities engineered for demanding aerospace, defense, medical, and high-performance computing applications. Our team will be discussing how QP Technologies and Promex deliver high-reliability solutions that support next-generation semiconductor innovation. We look forward to connecting with industry leaders and innovators! #ECTC2026 #AdvancedPackaging #HeterogeneousIntegration #Microelectronics #Semiconductor #ElectronicsManufacturing #QPTechnologies #Promex #ChipPackaging

At mmWave frequencies, packaging isn’t just part of the design — it defines performance. Our latest blog explores how packaging impacts signal integrity, thermal performance, reliability, and scalability in next-generation mmWave systems. As frequencies increase, every design and assembly decision matters. Discover how advanced packaging strategies help enable high-performance applications across 5G, aerospace, defense, and next-generation electronics. 📖 Read the full blog here: https://lnkd.in/e3Zz5xUc #mmWave #AdvancedPackaging #RFDesign #5G #Aerospace #DefenseTech #HighFrequency #QPTechnologies

At QP Technologies, we recognize that innovation is built on diverse perspectives, cultures, and traditions. This Cinco de Mayo, we celebrate the rich history and heritage behind the day, a reminder of resilience, collaboration, and the power of community. As we continue to push boundaries in advanced microelectronics packaging and assembly, we’re proud to foster a culture that values inclusion and global connection. Wishing everyone a safe and meaningful Cinco de Mayo! #CincoDeMayo #DiversityAndInclusion #QPTechnologies #Innovation #StrongerTogether

Ben Mendoza will be speaking this Tuesday, May 5th at 9:30am at the Space Parts Working Group (SPWG). He’ll be covering a timely topic as the industry continues to balance rapid commercial semiconductor innovation with the rigorous demands of military and aerospace applications—particularly in reliability, packaging, and long-term performance. Great to see leadership from Promex and QP Technologies contributing to this important conversation. Learn more: https://lnkd.in/eXk6GqE5 #Promex #QPTechnologies #Microelectronics #MilAero #Defense

We’re excited to announce a new chapter in leadership at QP Technologies and Promex Industries. David Fromm has been appointed President and Chief Operating Officer, bringing deep expertise in advanced instrumentation, process development, and microelectronics manufacturing. Since joining Promex, Dave has played a key role in developing specialized processes and driving innovation across our organizations. With a strong background spanning Cepheid, Agilent Technologies, and a Ph.D. in Physical Chemistry from Stanford, Dave combines technical depth with proven operational leadership. As we continue to grow and support increasingly complex, high-reliability applications, Dave will lead our strategic direction and operational execution—building on more than 50 years of excellence in advanced microelectronics assembly. Please join us in congratulating Dave on this well-deserved role. Read the full announcement here: https://lnkd.in/eifubeHv #Leadership #Microelectronics #Semiconductor #AdvancedPackaging #Innovation #QPTechnologies #Promex

Not All Wire Bonds Are Created Equal—Here’s Why It Matters When it comes to semiconductor packaging, the interconnect strategy isn’t just a process step, it directly impacts performance, reliability, and long-term durability. At QP Technologies, we match the wire bonding method to the mission. Here’s how each approach fits: 🔹 Ball Bonding (Thermosonic) Fast, precise, and ideal for fine-pitch, high I/O designs. This is the go-to for high-volume applications where efficiency and scalability matter. 🔹 Wedge Bonding (Ultrasonic/Thermocompression) Built for reliability. Using aluminum wire or ribbon, this method performs exceptionally well in harsh environments with thermal cycling and vibration—making it a staple in aerospace and defense. 🔹 Ribbon Bonding When power matters, ribbon delivers. Its larger cross-section lowers resistance and improves current handling—ideal for power electronics and RF applications. 🔹 Stud Bump Bonding Enabling next-generation packaging. This wire bond–derived technique supports fine-pitch, high-density interconnects for flip-chip and compact designs. There’s no one-size-fits-all solution. The right interconnect choice depends on your electrical, mechanical, and environmental requirements. That’s where experience makes the difference, aligning the bonding method with real-world performance demands. Check out our website for more of our capabilities https://lnkd.in/ePsvefpN #Microelectronics #Semiconductor #WireBonding #AdvancedPackaging #Engineering #Electronics #Aerospace #RF #HighReliability