Technology - IoT
IoT
1NCE's CIP Offers Open Access to Propel IoT Development Across Global Verticals
December 20, 2024
1NCE launched its Certified Integrators Program (CIP) that is aimed to empower external software developers to integrate seamlessly with 1NCE’s IoT platform. According to the press release, 1NCE equips integrators with tools to deliver streamlined, cost-effective IoT implementations for businesses across many verticals.
IoT
AAEON’s uCOM-IMX8P Debuts with 4K Display and AI Capabilities
December 19, 2024
AAEON introduced its uCOM-IMX8P, an adaptable SMARC 2.1 compliant CPU module built on the NXP i.MX 8M Plus platform with an 82mm x 50mm SMARC form factor to utilize RISC architecture. The solution leverages the NXP i.MX 8M Plus’ Quad-Core Arm Cortex-A53 processor with an integrated NPU, an operating temperature range from -40°C ~ 85°C, and 4GB of onboard LPDDR4 memory and up to 128GB eMMC storage (default SKU: 16GB).
IoT
PIMIC Unveils Business Strategy and Silicon Technology for AI at the Edge
December 18, 2024
Cupertino, CA – PIMIC announced its official corporate launch, unveiling its mission to deliver cutting-edge AI inferencing silicon designed to power the next generation of intelligent, voice-activated edge devices (VAD) including toys, home and business audio systems, wearables, and robots.
Meet the AIROC™ CYW5551x Wi-Fi 66E +Bluetooth® 5.4 Combo Family
December 5, 2024
Learn how the low-power, long-range AIROC™ CYW5551x Wi-Fi 6/6E and Bluetooth® combo delivers secure, reliable, high-quality connections for wearables, smart home, industrial and other form factor IoT applications. With the industry’s best transmit power and receiver sensitivity, and interference mitigation, see how this combo family helps your applications reliably operate over long ranges in congested environments.
Learn more: https://www.infineon.com/cms/en/product/wireless-connectivity/airoc-wi-fi-plus-bluetooth-combos/wi-fi-6-6e-802.11ax/
Analog & Power
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TDK Announces Industrial Power Supply Series With Optional Push-In Wire Terminations
December 13, 2024
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Product of the Week: Lattice Semiconductor’s Lattice Nexus™ 2 Next-Gen Small FPGA Platform
December 10, 2024
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onsemi Introduces Treo Platform to Enhance Power Management
December 09, 2024
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Electronica 2024 Recap
December 09, 2024
Automotive
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Winbond Announces Enhanced LPDDR4/4X DRAM Products for Automotive Applications
December 03, 2024
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Renesas Announces Automotive Multi-Domain SoC Built with 3-nm Process Technology
November 25, 2024
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Shrinking Automotive Power Chips to Advance Automotive AI
November 21, 2024
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Embedded Executive: The In-Cabin User Experience, indie Semiconductor
November 13, 2024
Storage
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Semidynamics' RISC-V Technology Powers UPMEM’s Next-Gen AI Processing-in-Memory Chips
December 09, 2024
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New Cryogenic Memory IP from sureCore Enables Quantum Control Electronics Inside Cryostats
November 26, 2024
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Embedded Executive: When, Where, and Why Use Rad-Hard Memory, Infineon
November 20, 2024
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The Road to electronica: Apacer has the Next-Generation of Industrial Storage
November 06, 2024
Processing
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IC’Alps and SEALSQ Set New Standards for Secure Chip Development
December 16, 2024
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Chipping In: Europe’s Role in the Semiconductor Industry
December 12, 2024
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IBASE IB996 CPU Card Combines Intel Core Power with Extensive I/O and Display Options
December 12, 2024
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DFI Introduces RAP310 Industrial Motherboard with AMD Zen 4 Architecture and DDR5 Support
December 11, 2024