WikiChip

@WikiChip

The official WikiChip Twitter account. Hardware (logic), computer architectures, & semiconductor engineering. Technical.

New York, NY
en.wikichip.org
Participa desde novembro de 2016
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  1. 27 de abr.

    Arm launches its next-gen server CPUs: Neoverse N2 & Neoverse V1 (formerly Perseus and Zeus). Targeting high-performance servers and the HPC market, the new cores bring 1.4-1.5x higher IPC, SVE support, BFloat16, and the ARMv9 architecture.

    1 resposta 15 retweets 63 curtiram
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  2. 6 de abr.

    Intel launches 3rd Gen Xeon Scalable, formerly Ice Lake-SP. Fabricated on 10nm, these server chips offer eight memory channels, go up to 40 Sunny Coves and offer a 20% IPC improvement over the last gen.

    1 resposta 14 retweets 38 curtiram
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  3. 5 de abr.

    Arm Highlights Near-Term Roadmap

    1 resposta 4 retweets 26 curtiram
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  4. 30 de mar.

    A decade after the release of ARMv8, today Arm is launching the ARMv9 architecture for the next decade of compute, focusing on security and specialized acceleration.

    2 respostas 11 retweets 48 curtiram
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  5. 22 de set. de 2020

    Arm updates its Neoverse roadmap with the Neoverse N2 & V1, introducing SVE support for the first time as well as bfloat16 operations. Like the Cortex-X, the Neoverse V-series will ease its power and area constraints in favor of higher perf.

    2 respostas 11 retweets 45 curtiram
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  6. 29 de jun. de 2020

    The Advanced Matrix Extension (AMX) is a new x86 extension that introduces matrix registers and matrix operations. AMX is expected to debut with Intel's Sapphire Rapids Xeon Processors in 2021.

    1 resposta 19 retweets 59 curtiram
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  7. 20 de jun. de 2020

    Launched earlier this year, the Cortex-M55 is the first core to feature the new Helium vector extension, a lightweight SIMD extension for embedded Arm cores. Here's another look at the core microarchitecture.

    10 retweets 25 curtiram
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  8. 15 de jun. de 2020

    Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. Lakefield allows the chip giant to dabble with several new complementary technologies that could potentially find broader uses in the future.

    1 resposta 14 retweets 45 curtiram
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  9. 26 de mai. de 2020

    Building on the A78, Arm launches the Cortex-X1, their most powerful Cortex CPU. Relying on early input from customers, the X-series relaxes the traditional PPA constraints of the Cortex-A series, allowing for a beefier design with higher performance.

    13 retweets 36 curtiram
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  10. 26 de mai. de 2020

    Arm introduces the Cortex-A78, formerly the Hercules microarchitecture, for next-generation smartphones and mobile devices - doubling down on efficiency.

    3 respostas 15 retweets 69 curtiram
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  11. 23 de mai. de 2020

    IBM releases Power ISA v3.1. Among the new instructions, there is new bfloat16 support, new reduced-precision outer-product operations including 4-bit integers, and new instruction prefixes. IBM plans on presenting POWER10 at Hot Chips 32.

    24 retweets 54 curtiram
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  12. 17 de mai. de 2020

    Intel's two major advanced packaging technologies are EMIB (2.5D) and Foveros (3D). ODI is a new family of technologies that bridges the gap between the two by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power. Details:

    1 resposta 18 retweets 64 curtiram
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  13. 15 de mai. de 2020

    Our SX-Aurora microarchitecture page has also been updated.

    2 retweets 10 curtiram
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  14. 15 de mai. de 2020

    NEC readies 2nd-generation Vector Engine, Type 20, offering higher memory bandwidth and a few more vector cores.

    2 respostas 8 retweets 29 curtiram
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  15. 14 de mai. de 2020

    TSMC announces its intention to build and operate an advanced 5-nanometer fab in Arizona. The company plans to pour $12B into the project.

    3 respostas 29 retweets 91 curtiram
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  16. 13 de mai. de 2020

    Intel introduces new entry-level Comet Lake Xeon W processors

    1 resposta 1 retweet 7 curtiram
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  17. 13 de mai. de 2020

    Intel launches new 10th generation Comet Lake vPro Processors

    2 respostas 5 retweets 14 curtiram
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  18. 30 de abr. de 2020

    Intel launches 10th Generation Core desktop processors, formerly code name Comet Lake. The new lineup brings 22 new chips with up to 10 cores and 20 threads with turbo frequencies of up to 5.3 GHz.

    7 retweets 29 curtiram
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  19. 17 de abr. de 2020

    TSMC ramps its 5-nanometer node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each mm² of silicon. More details:

    3 respostas 61 retweets 148 curtiram
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  20. 11 de abr. de 2020

    Ranovus launches its Odin Platform: multi-wavelength Quantum Dot Laser (QDL) silicon photonic engine - 800Gbps to 3.2Tbps single-chip engine as well as co-packaged optics scaling up to 51.2Tbps for next-gen DC switches and other HPC apps.

    16 retweets 58 curtiram
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