Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
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Arm Unveils Next-Gen Flagship Core: Cortex-X3
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GlobalWafers To Build A 1.2M WPM Factory In Sherman, Texas. #300mm
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Reincarnating The MOS Technology 6502 as Flexible Plastic Electronics For The Emerging Era of Ubiquitous Computing #ISSCC2022 #MOS6502 #800nm
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A Samsung-Esperanto concept AI-SSD prototype collab aims at accelerating data center workloads such as recommendation engines.
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Intel launches 12th Gen Core performance desktop processors based on the Alder Lake microarchitecture. #Intel7 #x86 #AlderLake
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Alibaba open-source its high-performance XuanTie RISC-V Cores; introduces a new in-house Armv9 server chip #Alibaba #RISCV #ArmServers #ARMv9 #5nm
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Intel introduces Loihi 2, a 2nd gen neuromorphic research chip. First chip fabricated on their Intel 4 EUV process, Loihi 2 brings faster processing & synaptic operations, new algorithms, & higher resource density with a neurons count of 1 million. #Intel4
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[S] Inside PFN's AI processor & the world's most power-efficient supercomputer. Packing 52B xTors across 3050 mm² of silicon, this accelerator was developed to give this Japanese startup a competitive advantage exclusively for its own internal hardware.
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While most AI startups are racing to the 'latest & greatest' node, Mythic is comfortably competing using 40nm. With flash & analog as their secrete weapon the company recently raised $70M in Series C to push their M1100-Series accelerators into production
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[S] Google accelerates YouTube and other video services with custom silicon.
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- Intel Thread Director fuse.wikichip.org/news/6123/inte
- ASIC DPU: Mount Evans fuse.wikichip.org/news/6128/inte
- Xe HPG fuse.wikichip.org/news/6133/inte
- Xe HPC & Ponte Vecchio fuse.wikichip.org/news/6132/inte
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Intel 2021 Architecture Day Coverage:
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- Small Core: Gracemont fuse.wikichip.org/news/6102/inte
- Big Core: Golden Cove fuse.wikichip.org/news/6111/inte
- Client SoC: Alder Lake fuse.wikichip.org/news/6115/inte
- Server SoC: Sapphire Rapids fuse.wikichip.org/news/6119/inte
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[S] Photonics chiplet inches towards production; demos 8 Tbps optically-connected FPGAs #TeraPHY #SiPhi #Photonics
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Arm introduces its Confidential Compute Architecture (CCA) which provides a mechanism for Realms, secure enclaves that may be used by any application in order to protect data in use from everything else on the system. #Armv9 #ConfidentialComputing
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[S] With Intel's acquisition of eASIC in 2018, the company's latest product - codenamed Diamond Mesa - attempts to bridge the gap between full ASIC and FPGAs.
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[S] With hybrid bonding inching towards production, here's a look at Trishul, Arm's first exploratory test chip - in collab with GF - that demos the feasibility of high-density 3D stacking using Arm's CoreLink CMN-600 extended to 3D. #12LP #HybridBonding
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AMD recently unveiled 3D V-Cache, their first 3D-stacked-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density. #HybridBonding #SoIC
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Arm Tech Day Coverage:
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-Little Core: Cortex-A510 fuse.wikichip.org/news/5268/arm-
-Big Core: Cortex-A710 fuse.wikichip.org/news/5267/arm-
-Flagship Big Core: Cortex-X2 fuse.wikichip.org/news/5269/arm-
-DSU-110 Cluster fuse.wikichip.org/news/5270/arm-
-Interconnects: CI-700 & NI-100 fuse.wikichip.org/news/5271/arm-
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CMN-700 is Arm's latest high-perf cache-coherent mesh interconnect for servers, enabling SoC designs with twice the cores, half a GiB of cache, dozens of mem controllers, & support dozens of cache-coherent accelerators, chiplets, & processors. #Neoverse
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