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[S] Inside PFN's AI processor & the world's most power-efficient supercomputer. Packing 52B xTors across 3050 mm² of silicon, this accelerator was developed to give this Japanese startup a competitive advantage exclusively for its own internal hardware.https://fuse.wikichip.org/news/6341/inside-pfns-ai-processor-and-the-worlds-most-power-efficient-supercomputer/ …
Gràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
A look at Qualcomm's Data Center Inference Accelerator, the Cloud AI 100.
#Inference#NPU#7nmhttps://fuse.wikichip.org/news/6311/a-look-at-qualcomms-data-center-inference-accelerator/ …Gràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
While most AI startups are racing to the 'latest & greatest' node, Mythic is comfortably competing using 40nm. With flash & analog as their secrete weapon the company recently raised $70M in Series C to push their M1100-Series accelerators into productionhttps://fuse.wikichip.org/news/5727/mythic-rolls-out-1100-series-analog-ai-accelerators-raises-70m-along-the-way/ …
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[S] Google accelerates YouTube and other video services with custom silicon.https://fuse.wikichip.org/news/6069/youtube-accelerates-transcoding/ …
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- Intel Thread Director https://fuse.wikichip.org/news/6123/intel-introduces-thread-director-for-heterogeneous-multi-core-workload-scheduling/ … - ASIC DPU: Mount Evans https://fuse.wikichip.org/news/6128/intels-mount-evans-intels-first-asic-dpu/ … - Xe HPG https://fuse.wikichip.org/news/6133/intel-unveils-xe-hpg-discrete-graphics-for-gamers/ … - Xe HPC & Ponte Vecchio https://fuse.wikichip.org/news/6132/intel-unveils-xe-hpc-and-ponte-vecchio/ … 2/2
Mostra el filGràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
Intel 2021 Architecture Day Coverage: New... - Small Core: Gracemont https://fuse.wikichip.org/news/6102/intels-gracemont-small-core-eclipses-last-gen-big-core-performance/ … - Big Core: Golden Cove https://fuse.wikichip.org/news/6111/intel-details-golden-cove-next-generation-big-core-for-client-and-server-socs/ … - Client SoC: Alder Lake https://fuse.wikichip.org/news/6115/intel-unveils-alder-lake-next-generation-mainstream-heterogeneous-multi-core-soc/ … - Server SoC: Sapphire Rapids https://fuse.wikichip.org/news/6119/intel-unveils-sapphire-rapids-next-generation-server-cpus/ … 1/2
Mostra el filGràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
[S] Photonics chiplet inches towards production; demos 8 Tbps optically-connected FPGAs
#TeraPHY#SiPhi#Photonicshttps://fuse.wikichip.org/news/6074/photonics-chiplet-inches-towards-production/ …Gràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
[S] TSMC's 5th Generation CoWoS-S Extends 3 Reticle Size.
#CoWoS#HBM2Ehttps://fuse.wikichip.org/news/6031/5th-gen-cowos-s-extends-3-reticle-size/ …Gràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding
#3DIC#HybridBondinghttps://fuse.wikichip.org/news/5949/intel-unveils-foveros-omni-and-foveros-direct-leveraging-hybrid-bonding/ …Mostra el filGràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp
#RibbonFET#GAA#GAAFEThttps://fuse.wikichip.org/news/5943/intel-announces-20a-node-ribbonfet-devices-powervia-2024-ramp/ …Mostra el filGràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A
#7nm#Intel20A#EUVhttps://fuse.wikichip.org/news/5946/intel-2021-process-technology-update/ …Mostra el filGràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
Gràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés
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A look at Esperanto's ET-SoC-1, the startup's first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores.
#RISCV#7nmhttps://fuse.wikichip.org/news/4911/a-look-at-the-et-soc-1-esperantos-massively-multi-core-risc-v-approach-to-ai/ …Gràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
[S] Samsung tapes out 3nm GAA test vehicle as it inches towards mass production
#3nm#GAA#GAAFET#MBCFEThttps://fuse.wikichip.org/news/5863/samsung-3nm-gaa-inches-towards-productization-with-sram-soc-test-vehicles/ …Gràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
[S] TSMC 2021 Foundry Update: Automotive, Networking, and HPC Roadmap
#7nm#5nm#HPChttps://fuse.wikichip.org/news/5767/tsmc-2021-foundry-update-automotive-networking-and-hpc-roadmap/ …Mostra el filGràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
Gràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés
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Marvell launches the OCTEON 10 DPU series. Fabricated on a 5 nm process, these chips integrate Neoverse N2 cores, AI acceleration, vector packet processing acceleration, a 1 terabit switch, and the latest DDR5 and PCIe 5.0 I/O interfaces.
#5nm#Armv9https://fuse.wikichip.org/news/5732/marvell-launches-5nm-octeon-10-dpus-with-neoverse-n2-cores-ai-acceleration/ …Gràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
Arm introduces its Confidential Compute Architecture (CCA) which provides a mechanism for Realms, secure enclaves that may be used by any application in order to protect data in use from everything else on the system.
#Armv9#ConfidentialComputinghttps://fuse.wikichip.org/news/5699/arm-introduces-its-confidential-compute-architecture/ …Gràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
[S] Intel talks 10-nanometer DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.
#10nm#7nm#5nmhttps://fuse.wikichip.org/news/5674/intel-talks-10nm-dtco-euv-benefits/ …Gràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés -
[S] With Intel's acquisition of eASIC in 2018, the company's latest product - codenamed Diamond Mesa - attempts to bridge the gap between full ASIC and FPGAs.https://fuse.wikichip.org/news/5639/intels-diamond-mesa-bridges-the-gap-between-asic-and-fpga/ …
Gràcies. El Twitter ho farà servir per millorar-te la cronologia. DesfésDesfés
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