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Marvell launches the OCTEON 10 DPU series. Fabricated on a 5 nm process, these chips integrate Neoverse N2 cores, AI acceleration, vector packet processing acceleration, a 1 terabit switch, and the latest DDR5 and PCIe 5.0 I/O interfaces.
#5nm#Armv9https://fuse.wikichip.org/news/5732/marvell-launches-5nm-octeon-10-dpus-with-neoverse-n2-cores-ai-acceleration/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
Arm introduces its Confidential Compute Architecture (CCA) which provides a mechanism for Realms, secure enclaves that may be used by any application in order to protect data in use from everything else on the system.
#Armv9#ConfidentialComputinghttps://fuse.wikichip.org/news/5699/arm-introduces-its-confidential-compute-architecture/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
[S] Intel talks 10-nanometer DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.
#10nm#7nm#5nmhttps://fuse.wikichip.org/news/5674/intel-talks-10nm-dtco-euv-benefits/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
[S] With Intel's acquisition of eASIC in 2018, the company's latest product - codenamed Diamond Mesa - attempts to bridge the gap between full ASIC and FPGAs.https://fuse.wikichip.org/news/5639/intels-diamond-mesa-bridges-the-gap-between-asic-and-fpga/ …
Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
[S] With hybrid bonding inching towards production, here's a look at Trishul, Arm's first exploratory test chip - in collab with GF - that demos the feasibility of high-density 3D stacking using Arm's CoreLink CMN-600 extended to 3D.
#12LP#HybridBondinghttps://fuse.wikichip.org/news/5588/a-look-at-trishul-arms-first-high-density-3d-logic-stacked-test-chip/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
AMD recently unveiled 3D V-Cache, their first 3D-stacked-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.
#HybridBonding#SoIChttps://fuse.wikichip.org/news/5531/amd-3d-stacks-sram-bumplessly/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
Arm Tech Day Coverage: New ... -Little Core: Cortex-A510 https://fuse.wikichip.org/news/5268/arm-unveils-next-gen-armv9-little-core-cortex-a510/ … -Big Core: Cortex-A710 https://fuse.wikichip.org/news/5267/arm-unveils-next-gen-armv9-big-core-cortex-a710/ … -Flagship Big Core: Cortex-X2 https://fuse.wikichip.org/news/5269/arm-launches-its-new-flagship-performance-armv9-core-cortex-x2/ … -DSU-110 Cluster https://fuse.wikichip.org/news/5270/arm-launches-the-dsu-110-for-new-armv9-cpu-clusters/ … -Interconnects: CI-700 & NI-100 https://fuse.wikichip.org/news/5271/arm-launches-new-coherent-and-non-coherent-soc-interconnects-ci-700-ni-700/ … .
Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
[S] The magnets under the icy lake.
#IceLake#10nm#FIVRhttps://fuse.wikichip.org/news/5008/the-magnets-under-the-icy-lake/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
CMN-700 is Arm's latest high-perf cache-coherent mesh interconnect for servers, enabling SoC designs with twice the cores, half a GiB of cache, dozens of mem controllers, & support dozens of cache-coherent accelerators, chiplets, & processors.
#Neoversehttps://fuse.wikichip.org/news/5006/the-mesh-network-for-next-generation-neoverse-chips/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
[S] Late last year Samsung ramped its 5LPE process. Here's a look at the details of the node and an update from Samsung Foundry on a few new roadmap nodes, 4nm improvements, and 3nm status.
#5nm#4nm#3nm#5LPE#Samsunghttps://fuse.wikichip.org/news/5004/samsung-details-5nm-and-4nm-adds-8lpa-5lpp-and-4lpp-nodes-readies-3nm-gaa-for-next-year/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
A look at the current state of leading-edge foundries for the first quarter of 2021.
#Intel#TSMC#Samsung#SMIChttps://fuse.wikichip.org/news/5002/q1-2021-foundry-update-spending-bonanza/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
[S] A look at Esperanto's ET-SoC-1, the startup's first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores.
#RISCV#7nmhttps://fuse.wikichip.org/news/4911/a-look-at-the-et-soc-1-esperantos-massively-multi-core-risc-v-approach-to-ai/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
The IEEE Symposium on High-Performance Chips announced the program for the
#HotChips33 conference. Presentations include AMD Zen 3 & RDNA2, Intel PV, Alder Lake & Sapphire Rapids, IBM next-gen Z, Arm N2, Nvidia DPU, Google VCU, Xilinx, and many many more.https://fuse.wikichip.org/news/4897/hot-chips-33-program-alder-lake-sapphire-rapids-zen-3-next-gen-z-neoverse-n2-and-many-more/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
In rolls out flagship premium performance 11th Generation Core Tiger Lake-based mobile processors with eight cores.https://fuse.wikichip.org/news/4862/intel-pushes-out-flagship-premium-tiger-lake-mobile-chips/ …
Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
WikiChip Fuse moves to a decaying paywall model.https://fuse.wikichip.org/news/4796/wikichip-fuse-moves-to-a-decaying-paywall-model/ …
Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
Arm launches its next-gen server CPUs: Neoverse N2 & Neoverse V1 (formerly Perseus and Zeus). Targeting high-performance servers and the HPC market, the new cores bring 1.4-1.5x higher IPC, SVE support, BFloat16, and the ARMv9 architecture.
#AArch64#ARMv9https://fuse.wikichip.org/news/4795/arm-launches-new-neoverse-n2-and-v1-server-cpus-1-4x-1-5x-ipc-sve-and-armv9/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
Intel launches 3rd Gen Xeon Scalable, formerly Ice Lake-SP. Fabricated on 10nm, these server chips offer eight memory channels, go up to 40 Sunny Coves and offer a 20% IPC improvement over the last gen.
#10nm#IceLake#SunnyCove#x86#Intelhttps://fuse.wikichip.org/news/4734/intel-launches-3rd-gen-ice-lake-xeon-scalable/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
Arm Highlights Near-Term Roadmap
#AArch64https://fuse.wikichip.org/news/4711/arm-highlights-near-term-roadmap/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
A decade after the release of ARMv8, today Arm is launching the ARMv9 architecture for the next decade of compute, focusing on security and specialized acceleration.
#ARM#ARMv8#ARMv9https://fuse.wikichip.org/news/4646/arm-launches-armv9/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi -
Arm updates its Neoverse roadmap with the Neoverse N2 & V1, introducing SVE support for the first time as well as bfloat16 operations. Like the Cortex-X, the Neoverse V-series will ease its power and area constraints in favor of higher perf.
#ArmNeoversehttps://fuse.wikichip.org/news/4564/arm-updates-its-neoverse-roadmap-new-bfloat16-sve-support/ …Hvala. Twitter će to iskoristiti za poboljšanje vaše vremenske crte. PoništiPoništi
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