WikiChip

@WikiChip

The official WikiChip Twitter account. Hardware (logic), computer architectures, & semiconductor engineering. Technical.

Vrijeme pridruživanja: studeni 2016.

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  1. 28. lip

    Marvell launches the OCTEON 10 DPU series. Fabricated on a 5 nm process, these chips integrate Neoverse N2 cores, AI acceleration, vector packet processing acceleration, a 1 terabit switch, and the latest DDR5 and PCIe 5.0 I/O interfaces.

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  2. 23. lip

    Arm introduces its Confidential Compute Architecture (CCA) which provides a mechanism for Realms, secure enclaves that may be used by any application in order to protect data in use from everything else on the system.

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  3. 22. lip

    [S] Intel talks 10-nanometer DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.

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  4. 13. lip

    [S] With Intel's acquisition of eASIC in 2018, the company's latest product - codenamed Diamond Mesa - attempts to bridge the gap between full ASIC and FPGAs.

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  5. 11. lip

    [S] With hybrid bonding inching towards production, here's a look at Trishul, Arm's first exploratory test chip - in collab with GF - that demos the feasibility of high-density 3D stacking using Arm's CoreLink CMN-600 extended to 3D.

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  6. 7. lip

    AMD recently unveiled 3D V-Cache, their first 3D-stacked-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.

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  7. 25. svi
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  8. 23. svi
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  9. 22. svi

    CMN-700 is Arm's latest high-perf cache-coherent mesh interconnect for servers, enabling SoC designs with twice the cores, half a GiB of cache, dozens of mem controllers, & support dozens of cache-coherent accelerators, chiplets, & processors.

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  10. 21. svi

    [S] Late last year Samsung ramped its 5LPE process. Here's a look at the details of the node and an update from Samsung Foundry on a few new roadmap nodes, 4nm improvements, and 3nm status.

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  11. 18. svi

    A look at the current state of leading-edge foundries for the first quarter of 2021.

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  12. 16. svi

    [S] A look at Esperanto's ET-SoC-1, the startup's first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores.

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  13. 13. svi

    The IEEE Symposium on High-Performance Chips announced the program for the conference. Presentations include AMD Zen 3 & RDNA2, Intel PV, Alder Lake & Sapphire Rapids, IBM next-gen Z, Arm N2, Nvidia DPU, Google VCU, Xilinx, and many many more.

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  14. 13. svi

    In rolls out flagship premium performance 11th Generation Core Tiger Lake-based mobile processors with eight cores.

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  15. 13. svi
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  16. 27. tra

    Arm launches its next-gen server CPUs: Neoverse N2 & Neoverse V1 (formerly Perseus and Zeus). Targeting high-performance servers and the HPC market, the new cores bring 1.4-1.5x higher IPC, SVE support, BFloat16, and the ARMv9 architecture.

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  17. 6. tra

    Intel launches 3rd Gen Xeon Scalable, formerly Ice Lake-SP. Fabricated on 10nm, these server chips offer eight memory channels, go up to 40 Sunny Coves and offer a 20% IPC improvement over the last gen.

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  18. 5. tra
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  19. 30. ožu

    A decade after the release of ARMv8, today Arm is launching the ARMv9 architecture for the next decade of compute, focusing on security and specialized acceleration.

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  20. 22. ruj 2020.

    Arm updates its Neoverse roadmap with the Neoverse N2 & V1, introducing SVE support for the first time as well as bfloat16 operations. Like the Cortex-X, the Neoverse V-series will ease its power and area constraints in favor of higher perf.

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