Ben Bodley

*** When I wrote the book on chiplets, I wanted it  to be practical and structured.​ *** Anyone in the industry (SoC architect, packaging engineer, validation lead, and others) could each open it to their chapter and find something useful. Here's the full table of  contents with a hint of what's inside: ​ ​ 1. System-on-a-Chip Architectures (evolution and history of SoCs, paradigm shifts)​. 2. The Rise of Chiplet-Based SoCs (chiplet advantages and industry adoption)​. 3. SoC Architecture Analysis (traditional vs modern methods of analysis, virtual prototyping)​. 4. Chiplets Partitioning & Analysis (heterogeneous vs homogeneous, workload optimization)​. 5. Chiplet-Based SoC Interconnects (UCIe, BoW, memory coherence)​. 6. Security in Chiplet-Based SoCs (new attack surfaces, threat modeling, zero trust architectures).​ 7. Software for Chiplet-Based SoCs (Software stack, SoC vs Chiplet-Based processes, testing & debugging). ​ 8. Packaging Technologies (2.5D vs 3D vs 3.5D, manufacturing constraints)​. 9. Power & Thermal Management (PDNs, measurement techniques, cooling solutions)​. 10. Cost & Yield Considerations (economic drivers, cost models, manufacturing).  11. Chiplet-Based SoC Application (in HPC, Data Centers, Gaming Consoles, and Autonomous Vehicles). ​ 12. Future of Chiplet-Based SoCs (standardization, open ecosystems, emerging technologies)​. ​ Now available on Amazon in hardcover, paperback, and Kindle. You will enjoy reading the book on complex subject written in a simple way.

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11 #radiofrequencyPCB trace design guidelines 🔶 1. Route RF traces first, and employ impedance-matching techniques for each RF trace. 🔶 2. Utilize microstrips for RF traces to handle short interconnections between components, ideally within a shielded area with outer metal layers. 🔶 3. Keep the length of RF traces as short as possible to reduce attenuation. 🔶 4. Avoid placing RF traces parallel to signal traces to prevent interference. 🔶 5. Include ground planes to provide return paths for signals. Fill the area around RF traces with ground and ground vias to connect with inner ground layers for better isolation. 🔶 6. Route traces directly to vias whenever possible to minimize stubs. This helps maintain signal integrity and reduces the risk of signal reflections and crosstalk. 🔶 7. Use wider traces to reduce resistance and inductance, minimizing signal loss. However, wider traces can increase the risk of crosstalk and interference, so a balance is necessary based on the specific RF circuit requirements. 🔶 8. Evaluate whether to remove the solder mask from the RF traces based on assembly and electrical performance considerations. Note that solder mask design rules typically specify a 4 mil spacing between the solder mask edge and the trace edge. 🔶 9. Remove the solder mask from RF traces for extremely low-loss and very high-frequency applications to prevent increased loss from the solder mask’s higher dielectric constant. 🔶 10. Avoid placing test points on RF traces. Doing so will interrupt the trace's impedance-matching values. 🔶 11. Miter right-angled traces to ensure constant impedance across the bends. 💡Read the full blog for more details: https://lnkd.in/gzB_FWw6 #pcbdesigners #rfengineers #hardwareengineers #electricalengineering

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Surprise breakdowns don't just cost you money—they cost you customers. Predictive maintenance is transforming how Australian manufacturers compete, turning potential disasters into planned interventions. Here's how smart sensors are becoming every factory's best friend. Shane Williams Virtual CTO Strategic Technology Advisor #AustralianManufacturing

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In this comprehensive tutorial, we dive into the world of RF Power Amplifiers, crucial devices that amplify signals for wireless communication. Amplifiers are integral to boosting signal strength and ensuring high-quality performance in systems like audio equipment and communication devices. RF power amplifiers are essential for driving antennas effectively, enabling efficient and reliable wireless transmission. This video will guide you through the process of designing RF power amplifiers using Advanced Design System (ADS), offering valuable insights for both beginners and experienced engineers. 📊 Key Topics Covered: • Introduction to RF Power Amplifiers • Step-by-step circuit design in ADS • Simulation setup and analysis • Impedance matching & efficiency optimizations By the end, you’ll be equipped with the knowledge to design and simulate powerful, high-performance RF amplifiers for a variety of applications. Perfect for students, RF enthusiasts, and engineers! 🔔 Subscribe for more tutorials on RF/microwave circuits, ADS simulations, and engineering tips. 📅 Timestamps: 00:00:00 Introduction 00:00:18 What is an RF Amplifier? 00:00:45 Key Amplifier Parameters 00:01:25 Power Transistor Basics 00:02:09 Designing RF Power Amplifier in ADS 00:02:12 Biasing 00:05:44 Stability 00:09:35 Load Pull 00:13:47 Matching Network 00:44:18 Final design (Schematic) 01:01:13 Final design (layout) 01:10:00 Simulated Results & Conclusion #RFAmplifier #ADS #PowerAmplifier #MicrowaveEngineering #WirelessCommunication #SimulationTools #RFDesign #ImpedanceMatching #AdvancedDesignSystem #ElectronicsEngineering #TechTutorials #SignalProcessing

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Spatial audio - what is all the fuss about? Quite a few product makers are claiming "Spatial Sound" or "Immersive Audio" for headphones. Most implementations leave the listener confused and disappointed. We've been listening to a lot of experts across the audio industry to determine why this is the case. Now we have a summary of what we've learned so far... https://lnkd.in/gy6Wdd2p #Headphone3 #ImmersiveAudio #SpatialSound #UseYourEars

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Excited to share a new breakthrough in the Spin Photo Detector for Photonic Integrated Circuit (PIC) has arrived. It has a potential to significantly enhance optical communication in telecom and datacom market. This new technology uses magnetism instead of semiconductor photo detector, which provides several advantages: - Wider range of wavelengths including shorter-wave visible lights to make the device more compact and increase speed - Does not requires substrate to integrate into PIC. This allows highly dense and compact device integration. To learn more: https://lnkd.in/eC6H9DFq

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Are Small-Capacity eMMCs on the Brink of Extinction? Major NAND manufacturers are pulling the plug on small-capacity storage: 4GB eMMC 8GB eMMC SSDs under 32GB Low-density modules Why? Economics. But this leaves industrial, medical, and automotive applications in a tough spot. Think about it: ✅ Boot drives (~1-2GB) ✅ PLC controllers (~500MB-1.5GB) ✅ Medical device firmware (~1-3GB) ✅ HMI/operator interfaces (~1GB) These aren’t optional—they’re mission-critical. Yet they’re becoming “legacy” overnight, creating a supply crunch for systems that can’t be redesigned easily. 👉 Are you tracking EOL notices for your small-capacity storage? 👉 Do you have enough stock to keep production running? Don’t wait until it’s too late. Secure your supply now: https://lnkd.in/gfCYMdBP Send Your RFQ! We ADD Value! Learn more: ktts.us Request for quote: https://lnkd.in/gAWMHAqh Book a call: https://lnkd.in/gQAB2qZM Subscribe for the latest updates: https://lnkd.in/gua6gy9k #EmbeddedSystems #IndustrialAutomation #MedicalDevices #AutomotiveTech #eMMC #FlashStorage #SupplyChainRisk #LegacySystems #TechSolutions #KTTechnicalSolutions

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“It’s digital, so the cable doesn’t matter.” I’ve heard that sentence far too many times. In truth, it’s one of the most expensive myths in AV. When I began designing electronics more than five decades ago, the world was analogue. We fought crosstalk, noise, and attenuation daily, through careful layout, shielding, and respect for the laws of physics. Then digital arrived, and many believed the problems were gone. After all, if it’s just ones and zeros, what could go wrong? But digital didn’t eliminate the problem, it changed its disguise. Analogue gave you warning signs: hiss, hum, or a fading picture. Digital gives you nothing until it fails completely. One moment, perfect; the next, sparkles… or black. That’s why at SY Electronics Ltd, we’ve never stopped treating signal integrity as sacred. Even in today’s world of high-speed digital links, the quality of the medium still defines the outcome. Take our new SY full-featured USB-C cable as an example. Instead of relying on copper, it uses fibre optics for high-speed data and video transmission. Inside is an intricate blend of conductors and protection layers, all working together to deliver 10Gbps USB 3.2 Gen2, 60 W fast charging, and up to 8K @ 60 Hz video performance. It’s slimmer, lighter, and offers exceptional anti-EMI/EMC characteristics, this isn’t just a cable; it’s proof that even in the digital age, engineering discipline still matters. Digital may be about ones and zeros but delivering them reliably, every time, is still an analogue art.......and oh by the way those USB C cables are available in lengths from 5 m to 15 m! #ProAV #ElectronicsEngineering #SignalIntegrity #USBTypeC #FibreOptic #AVDesign #SYelectronics

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