Telink Semiconductor

🔋 Power Your Wireless Devices with a Powerful Core – TL3228 SoC, New Release An all-round wireless core engineered for the ultimate experience. The TL3228 features a dual-core RISC-V architecture and supports Bluetooth® 6.0, Matter, and Telink’s proprietary HDT technology for seamless multi-standard integration. • Ultra-Fast, Ultra-Low Latency: Leveraging HDT technology to empower true 8K gaming peripherals. • Ultra-Low Power Consumption: Only 3.8 mA in receive mode and as low as 0.7 µA in deep sleep. • High-Performance Computing: 192 MHz clock speed with 384 KB SRAM to effortlessly handle complex scenarios. Empowering smart home and professional gaming devices to accelerate product development. Learn more 👉 https://lnkd.in/gmRtdJ6Q #Telink #Semiconductor #IoT #RISCV #ChipDesign #TL3228

At #EmbeddedWorld2026, Telink showcased two wireless connectivity breakthroughs: • True 8K Wireless Gaming: Built on the TL322X series SoC, this solution integrates Telink HDT low-latency wireless technology, dual-core high-efficiency computing, and a high-speed USB interface —creating a seamless end-to-end data path and providing comprehensive support for true 8K wireless gaming. • Amazon Sidewalk: Deep integration of Bluetooth LE and Sub-GHz for dynamic switching between indoor short-range and outdoor wall-penetrating scenarios, extending coverage from home to community Driving IoT from basic connectivity to elevated user experience. Learn more 👉 https://lnkd.in/gN9FADHx #Telink #EmbeddedWorld2026 #True8K #TL322X #AmazonSidewalk #IoT

@TelinkSemi at #BluetoothAsia 2026 Speaker: Elizabeth Huang Topic: ULL HID + Channel Sounding Dual-Core Power – TL3228 Defines Next-Gen Bluetooth Low Latency & Precise Ranging 📅 Apr 23–24, 2026 📍 Hall 5, Shenzhen Convention & Exhibition Center (Futian) Scan to register #ULLHID #ChannelSounding #LowLatency #PreciseRanging #Telink #TL3228

At Embedded World 2026 in Nuremberg, Telink unveiled its TL322X series SoC and ML3228A module—a versatile “chip + module” solution designed to help developers meet the growing demands of wireless connectivity across all IoT scenarios, from true 8K gaming to smart home and automotive applications.   Our team engaged with technical experts and industry leaders, introducing the new TL322X SoC and hosting live demonstrations that highlighted its multi-protocol concurrency, low-latency performance, and the out-of-the-box simplicity of the ML3228A module for rapid product development.   If you couldn’t join us in person, we’ve put together a full recap covering key insights from our conversations, an overview of our technology demos, and practical guidance on how TL322X and ML3228A can accelerate your next connected device project.   Learn more: https://lnkd.in/gym4hkBR   #EmbeddedWorld2026 #TelinkSemiconductor #TL322X #ML3228A #WirelessConnectivity #IoT

【Embedded World 2026 Comes to a Close | The True 8K Wireless Gaming Experience Lives On】 Embedded World 2026 has officially wrapped up, but the excitement around true 8K wireless gaming continues at the Telink booth! 🔥 A huge thank you to all the engineers and gamers who visited us and experienced firsthand the ultra-low latency and buttery-smooth performance of our true 8K gaming peripherals—mice, keyboards, and gamepad—all powered by the TL322X SoC. It was inspiring to connect with industry peers and explore how we can shape the next generation of wireless gaming ecosystems together. Stay tuned as we continue to push boundaries with the TL322X SoC and unlock the full potential of true 8K wireless gaming. #EmbeddedWorld2026 #TelinkSemiconductor #True8K #TL322X #GamingPeripherals 

【Final Day at #EmbeddedWorld2026 | Telink Live from Nuremberg】 As the exhibition wraps up, Telink (Booth 3A-328) thanks all industry professionals who visited us!   Our Full-Duplex Headset Wireless Intercom System Solution has garnered significant attention for its blend of ultra-low power and high performance: 🔹 Ultra-Low Power: Operating current as low as 1mA range. 🔹 Long-Distance Networking: Supports 24 Devices Networking with 2km max intercom distance. 🔹 True Full-Duplex: Enables seamless 5 Device Full Duplex Communication. 🔹 Global Ecosystem: Bluetooth® 6.0 certified, compatible with Apple Find My & Google Nearby. 🔹 Edge Computing & Security: 240MHz RISC-V MCU with PSA Level 1 certification.   Visit us on this final day or contact our sales team to learn more! #EmbeddedWorld2026 #Telink #WirelessIntercom #FullDuplex #IoT #Bluetooth6

Live from Embedded World 2026 – Day 2: True 8K Wireless Gaming Takes Center Stage 🎮⚡ Our booth is buzzing with excitement as we showcase true 8K wireless gaming peripherals — mice, keyboards, and gamepad. Industry professionals are captivated by our True 8K wireless gaming solution powered by the newly launched TL322X SoC, marveling at its Ultra-low latency and exceptional performance. Key technology highlights: True 8K polling rate for instant response with low-power performance Telink HDT technology delivering up to 6Mbps wireless speed and ultra-low latency HS USB 480Mbps interface for high-bandwidth transmission Dual-Core Processing + Hybrid RRAM+Flash Memory Architecture for real-time efficiency In-depth technical discussions around real-world deployment — that's what makes embedded events truly special. Visit us at booth 3A-328 and witness the future of wireless gaming firsthand! #EmbeddedWorld2026 #TelinkSemiconductor #True8K #WirelessGaming #TL322X #GamingPeripherals

📢On the opening day of Embedded World 2026, Telink Semiconductor is thrilled to participate in the world’s leading embedded exhibition! We sincerely invite you to visit us at 📍Booth 3A-328 in Nuremberg, Germany, to explore our TL322X SoC and high-performance wireless embedded solutions. Join us for industry insights, technical exchanges and business collaboration opportunities. #EmbeddedWorld2026 #TelinkSemiconductor #TL322X 

📢 Reminder: Embedded World 2026 is approaching! We invite embedded, Bluetooth, and gaming tech professionals to join our exclusive session: 《Enhancing the responsiveness of Bluetooth® gaming controllers with HID ISO》 Speaker: Jan Slupski, Principal Engineer, Telink Semiconductor ⏰ Time: March 12, 2026, 12:15-12:45 📍 Venue: NCC Ost, Level 2, Room KOPENHAGEN, Nuremberg Messe, Germany Only a few days left—join us to explore the latest in Bluetooth innovation and low-latency gaming peripherals. We look forward to meeting you in Nuremberg! #EmbeddedWorld2026 #Bluetooth #GamingPeripherals #TelinkSemiconductor

Multi-protocol support has become a baseline requirement for connected devices. Smart home products, lighting systems, and industrial IoT platforms are increasingly expected to support Bluetooth®, Thread, Zigbee, Matter, and proprietary 2.4 GHz communication, often within the same product family. But without disciplined firmware architecture and early coexistence planning, multi-protocol development can quickly lead to redesign cycles, certification complexity, and long-term maintenance challenges. Explore practical system-level considerations and how multi-protocol SoC platforms help reduce redesign risk and protect engineering investment: https://bit.ly/4cNpzR9 #MultiProtocol #ProductDevelopment #Bluetooth #Thread #Zigbee #IoT